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首页> 外文期刊>Physica, C. Superconductivity and its applications >Fabrication and properties of Bi2223 tapes with CuO barrier formed by the in situ oxidation method
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Fabrication and properties of Bi2223 tapes with CuO barrier formed by the in situ oxidation method

机译：原位氧化法形成CuO阻挡层Bi2223带材的制备与性能

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摘要

Although Ag sheathed Bi2223 tapes have the performances of I-c values over 100 A and length of 1000 m which are enough for prototype applications, their AC loss is still too high for practical applications. To reduce the AC loss, the introduction of high resistive barrier between filaments and the filament twisting are effective. In this study, the Bi2223 tapes with CuO barriers between filaments were fabricated through the ill Situ Oxidation method. Mono-core wires covered with metal Cu were stacked and deformed to form 19-filamentary tapes. These tapes were sintered, and the metal Cu layer was oxidized to form CuO barrier layer. Although the CuO grains in barrier layer easily agglomerated during sintering, the continuity Of CuO barrier Could be kept well by decreasing total sintering time and by the use of thick barrier layer. However the conversion ratio from Bi2212 to Bi2223 became low by increasing the barrier thickness. In addition, XRD analysis revealed that the impurity phase of (Sr, Ca)(14)Cu24Ox phase easily formed in the thick barrier tape. The J(c) value of over 1 x 10(4) A/cm(2) at 77 K, 0T was achieved in CuO barrier tape with the initial thickness of 20 mu m. The proper control of initial thickness and sintering conditions is important to achieve high J(c) and good continuity of barrier.
机译：尽管Ag包覆的Bi2223胶带具有超过100 A的I-c值性能和1000 m的长度，足以满足原型应用的要求，但其交流损耗对于实际应用而言仍然过高。为了减少交流损耗，在灯丝之间引入高电阻势垒和灯丝扭曲是有效的。在这项研究中，通过病原体氧化法制造了在长丝之间具有CuO势垒的Bi2223胶带。将覆盖有金属Cu的单芯线堆叠并变形，以形成19条带。烧结这些带，并且将金属Cu层氧化以形成CuO阻挡层。尽管阻挡层中的CuO晶粒在烧结过程中很容易结块，但通过减少总烧结时间和使用厚的阻挡层，可以很好地保持CuO阻挡层的连续性。然而，通过增加势垒厚度，从Bi 2212到Bi 2223的转化率变低。另外，XRD分析表明，（Sr，Ca）（14）Cu24Ox相的杂质相容易在厚的阻挡带中形成。在初始厚度为20μm的CuO阻隔带中，在77 K，0T下的J（c）值超过1 x 10（4）A / cm（2）。适当控制初始厚度和烧结条件对于获得高J（c）和良好的势垒连续性很重要。

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