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首页> 外文期刊>Surface & Coatings Technology >Structure and properties of Ti films deposited by dc magnetron sputtering, pulsed dc magnetron sputtering and cathodic arc evaporation
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Structure and properties of Ti films deposited by dc magnetron sputtering, pulsed dc magnetron sputtering and cathodic arc evaporation

机译：直流磁控溅射，脉冲直流磁控溅射和阴极电弧蒸发沉积的Ti膜的结构和性能

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摘要

Nanocrystalline Ti films were deposited by continuous dc magnetron sputtering (dcMS), pulsed dc magnetron sputtering (PMS) and cathodic arc evaporation (CAE) separately. Their structures were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Mechanical and corrosion properties were studied via nanoindentation, microscratch test and electrochemical measurement. It was found that the dcMS Ti film exhibited a loose porous columnar structure with low film-substrate adhesion. Abundant macroparticles could be observed on the surface of CAE Ti film and it had a low film-substrate adhesion. On the other hand, the ion flux and ion energy of deposited particles in the PMS plasma were enhanced by increasing the average target power and decreasing the area of the sputter track as compared to those of the dcMS plasma. The high-power -density PMS Ti film exhibited a dense microstructure, fine grain size and smooth surface, with jointly enhanced corrosion resistance (corrosion current density of 0.04 mu A.cm(-2)) and film-substrate adhesion (critical load of 50 N). (C) 2016 Elsevier B.V. All rights reserved.
机译：分别通过连续直流磁控溅射（dcMS），脉冲直流磁控溅射（PMS）和阴极电弧蒸发（CAE）沉积纳米晶Ti膜。通过X射线衍射（XRD），扫描电子显微镜（SEM）和透射电子显微镜（TEM）对它们的结构进行了表征。通过纳米压痕，微划痕试验和电化学测量研究了机械和腐蚀性能。发现dcMS Ti膜表现出疏松的多孔柱状结构，且膜-基底的粘附性低。在CAE Ti膜的表面上可以观察到大量的大颗粒，并且其与膜-基底的粘附力较低。另一方面，与dcMS等离子体相比，通过增加平均目标功率并减小溅射轨迹的面积，可以提高PMS等离子体中沉积粒子的离子通量和离子能量。高功率密度的PMS Ti薄膜具有致密的微观结构，细小的晶粒尺寸和光滑的表面，并具有共同增强的耐腐蚀性（腐蚀电流密度为0.04μA.cm（-2））和膜-基底附着力（临界载荷为50 N）。 （C）2016 Elsevier B.V.保留所有权利。

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