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Mechanical poly(amide and thermal properties of ceramic-modified imide)

机译:机械聚酰胺(酰胺和陶瓷改性酰亚胺的热性能)

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摘要

Poly(amide imide)-epoxysilane (coupling agent) composites were reacted with silica, a condensation product of tetraethylorthosilicate (TEOS), by a sol-gel process and were then cast into films. After this procedure, the chemical characteristics and mechanical and thermal properties were measured. Fourier transform infrared showed that silica existed in the poly(amide imide) matrix. When a proper amount of silica was added to the poly(amide imide) matrix, the tensile strength, elongation, and toughness increased greatly. A poly(amide imide)/30 wt% epoxysilane composite with 20 wt% TEOS had the best mechanical properties. Thermogravimetric analysis under nitrogen and oxygen atmospheres indicated that the char contents increased with the amount of silica. The glass-transition temperatures of the poly(amide imide)-silica nanocomposites were observed around 170-180degreesC with differential scanning calorimetry. This approach may be a new method for the low-temperature thermal curing of poly(amide imide). (C) 2004 Wiley Periodicals, Inc.
机译:通过溶胶-凝胶法使聚(酰胺酰亚胺)-环氧硅烷(偶联剂)复合物与二氧化硅(原硅酸四乙酯(TEOS)的缩合产物)反应,然后流延成膜。在该程序之后,测量化学特性以及机械和热性能。傅立叶变换红外光谱表明二氧化硅存在于聚(酰胺酰亚胺)基质中。当向聚(酰胺酰亚胺)基体中添加适量的二氧化硅时,抗张强度,伸长率和韧性大大提高。具有20 wt%TEOS的聚(酰胺酰亚胺)/ 30 wt%环氧硅烷复合材料具有最佳的机械性能。在氮气和氧气气氛下的热重分析表明,炭含量随二氧化硅含量的增加而增加。用差示扫描量热法观察到聚(酰胺酰亚胺)-二氧化硅纳米复合材料的玻璃化转变温度为约170-180℃。这种方法可能是一种新的低温热固化聚酰亚胺酰胺的方法。 (C)2004年Wiley Periodicals,Inc.

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