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首页> 外文期刊>Journal of Applied Polymer Science >Adhesion property of novel polyimides with 1-[3 ',5 '-bis(trifluoromethyl)phenyl] pyromellitic dianhydride
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Adhesion property of novel polyimides with 1-[3 ',5 '-bis(trifluoromethyl)phenyl] pyromellitic dianhydride

机译：新型聚酰亚胺与1- [3'，5'-双（三氟甲基）苯基]均苯四酸二酐的粘合性能

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摘要

Novel polyimides were synthesized from 1-[3',5'-bis(trifluoromethyl)phenyl] pyromellitic dianhydride (6FPPMDA) by a conventional two-step process: the preparation of poly(amic acid) followed by solution imidization via refluxing in p-chlorophenol. The diamines used for polyimide synthesis included bis(3-aminophenyl)-3,5-bis(trifluoromethyl)phenyl phosphine oxide, bis(3-aminophenyl)-4-trifluoromethylphenyl phosphine oxide, and bis(3-aminophenyl)phenyl phosphine oxide. The synthesized polyimides were designed to have a molecular weight of 20,000 g/mol by off-stoichiometry and were characterized by Fourier transform infrared, NMR, differential scanning calorimetry, and thermogravimetric analysis. In addition, their intrinsic viscosity, solubility, water absorption, and coefficient of thermal expansion (CTE) were also measured. The adhesion properties of the polyimides were evaluated via a T-peel test with bare and silane/Cr-coated Cu foils, and the failure surfaces were investigated with scanning electron microscopy. The 6FPPMDA-based polyimides exhibited high glass-transition temperatures (280-299 degrees C), good thermal stability (> 530 degrees C in air), low water absorption (1.46-2.16 wt %), and fairly low CTEs (32-40 ppm/degrees C), in addition to good adhesion properties (83-88 g/mm) with silane/Cr-coated Cu foils. (c) 2005 Wiley Periodicals, Inc.
机译：新型的聚酰亚胺是由1- [3'，5'-双（三氟甲基）苯基]均苯四甲酸二酐（6FPPMDA）通过常规的两步方法合成的：制备聚酰胺酸，然后通过在p-氯酚。用于聚酰亚胺合成的二胺包括双（3-氨基苯基）-3，5-双（三氟甲基）苯基氧化膦，双（3-氨基苯基）-4-三氟甲基苯基氧化膦和双（3-氨基苯基）苯基氧化膦。通过非化学计量法将合成的聚酰亚胺设计为具有20,000 g / mol的分子量，并通过傅立叶变换红外光谱，NMR，差示扫描量热法和热重分析进行表征。另外，还测量了它们的特性粘度，溶解度，吸水率和热膨胀系数（CTE）。通过T-剥离试验对裸露的和硅烷/铬涂层的铜箔进行聚酰亚胺的粘合性能评估，并通过扫描电子显微镜研究破坏面。基于6FPPMDA的聚酰亚胺表现出高的玻璃化转变温度（280-299摄氏度），良好的热稳定性（在空气中> 530摄氏度），低吸水率（1.46-2.16 wt％）和相当低的CTE（32-40） （ppm /℃），以及与硅烷/铬涂层铜箔的良好粘合性能（83-88 g / mm）。 （c）2005年Wiley Periodicals，Inc.

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