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首页> 外文期刊>Journal of Applied Polymer Science >Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages
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Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages

机译：电子封装用聚合树脂的固化行为和残余应力

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摘要

Polymeric encapsulants are applied in electronic packages to improve the mechanical/thermal performance and the reliability of packaged devices. During the curing process of encapsulating resin, large residual stresses are generated due to the shrinkage of polymer and the mismatches in the coefficient of thermal expansion (CTE) between various package components. In addition, the rheological properties and curing kinetics of the resin also affect the nature and distribution of residual stresses. In this work, the rheological and curing behavior of encapsulating resins are characterized using an oscillatory rheometer. The resin viscosity is closely monitored against curing temperature excursion, which is correlated to exothermic reaction and weight loss as measured from the DSC and TGA analyses. The evolution of residual stresses in encapsulating resin is evaluated in a bimaterial strip bending experiment (BMSB) in situ within a DMA chamber. The CTE values are then calculated based on the thermomechanical analysis, which are well compared with those determined from other sources. A transition temperature, apart from the glass transition temperature, is identified from the study of the changes in resin flexural modulus and residual stress profiles. (C) 2005 Wiley Periodicals, Inc.
机译：聚合物密封剂应用于电子封装中，以提高机械/热性能以及封装器件的可靠性。在封装树脂的固化过程中，由于聚合物的收缩以及各种包装组件之间的热膨胀系数（CTE）不匹配，会产生较大的残余应力。另外，树脂的流变性质和固化动力学也影响残余应力的性质和分布。在这项工作中，使用振荡流变仪来表征封装树脂的流变和固化行为。密切监测树脂粘度以防固化温度偏移，该偏移与从DSC和TGA分析测得的放热反应和重量损失相关。在双材料带弯曲实验（BMSB）中，在DMA腔室内就地评估了封装树脂中残余应力的变化。然后根据热力学分析计算CTE值，并将其与其他来源确定的值进行比较。通过研究树脂挠曲模量和残余应力曲线的变化，可以确定除玻璃转变温度以外的转变温度。 （C）2005 Wiley期刊公司

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