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首页> 外文期刊>Journal of Applied Polymer Science >Synthesis and characterization of new functional poly(urethane-imide) crosslinked networks
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Synthesis and characterization of new functional poly(urethane-imide) crosslinked networks

机译：新型功能性聚氨基甲酸酯-酰亚胺交联网络的合成与表征

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摘要

To synthesize new functional poly(urethaneimide) crosslinked networks, soluble polyimide from 2,2'bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 4,4'-oxydianiline, and maleic anhydride and polyurethane prepolymer from polycaprolactone diol, tolylene 2,4-diisocyanate and hydroxyl ethyl acrylate were prepared. Poly(urethane-imide) thin films were finally prepared by the reaction between maleimide end-capped soluble polyimide (PI) and acrylate end-capped polyurethane (PU). The effect of polyurethane content on dielectric constant, residual stress, morphology, thermal property, and mechanical property was studied by FTIR, prism coupler, Thin Film Stress Analyzer (TFSA), XRD, TGA, DMTA, and Nano-indentation. Dielectric constant of poly(urethane-imide) thin films (2.39-2.45) was lower than that of pure polyimide (2.46). Especially, poly(urethane-imide) thin films with 50% of PU showed lower dielectric constant than other poly(urethane-imide) thin films did. Lower residual stress and slope in cooling curve were achieved in higher PU content. Compared to typical polyurethane, poly(urethane-imide) thin films exhibited better thermal stability due to the presence of the imide groups. The glass transition temperature, modulus, and hardness decreased with increase in the flexible PU content even though elongation and thermal expansion coefficient increased. Finally, poly(urethane-imide) thin films with low residual stress and dielectric constant, which are strongly affected by the morphological structure, chain mobility, and modulus, can be suggested to apply for electronic devices by variation of PU. (c) 2006 Wiley Periodicals, Inc.
机译：为了合成新的功能性聚（氨基甲酰亚胺）交联网络，可从2,2'双（3,4-二羧基苯基）六氟丙烷二酐，4,4'-氧二苯胺，马来酸酐和聚氨酯预聚物由聚己内酯二醇，甲苯2,4制备了二异氰酸酯和丙烯酸羟乙酯。最后，通过马来酰亚胺封端的可溶性聚酰亚胺（PI）和丙烯酸酯封端的聚氨酯（PU）之间的反应，制备了聚（氨基甲酸酯-酰亚胺）薄膜。通过FTIR，棱镜耦合器，薄膜应力分析仪（TFSA），XRD，TGA，DMTA和纳米压痕研究了聚氨酯含量对介电常数，残余应力，形貌，热性能和机械性能的影响。聚（氨基甲酸酯-酰亚胺）薄膜（2.39-2.45）的介电常数低于纯聚酰亚胺（2.46）的介电常数。特别地，具有50％的PU的聚（氨基甲酸酯-酰亚胺）薄膜显示出比其他聚（氨基甲酸酯-酰亚胺）薄膜更低的介电常数。较高的PU含量可实现较低的残余应力和冷却曲线的斜率。与典型的聚氨酯相比，由于酰亚胺基团的存在，聚（氨基甲酸酯-酰亚胺）薄膜表现出更好的热稳定性。即使伸长率和热膨胀系数增加，玻璃化转变温度，模量和硬度也随着柔性PU含量的增加而降低。最后，具有低残余应力和低介电常数的聚（氨酯-酰亚胺）薄膜受到形态结构，链迁移率和模量的强烈影响，可以建议通过改变PU来应用于电子设备。 （c）2006年Wiley Periodicals，Inc.

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