• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Applied Polymer Science >Wear Resistance of Low-Temperature Plasma-Polymerized Organosilica Deposited on Poly(ethylene terephthalate): The Effect of Discharge Powers
【24h】

Wear Resistance of Low-Temperature Plasma-Polymerized Organosilica Deposited on Poly(ethylene terephthalate): The Effect of Discharge Powers

机译：沉积在聚对苯二甲酸乙二醇酯上的低温等离子体聚合有机硅的耐磨性：放电功率的影响

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

An investigation was conducted into plasma polymerization of transparent organosilica (SiOxCy) onto flexible transparent polyethylene terephthalate (PET) substrates for improving wear resistance. The plasma-polymerized SiOxCy with tetramethylsilane (TMS) and oxygen (02) gases in room temperature (23 degrees C) was proven to highly enhance the wear resistance from the completely worn of untreated PET substrates to no worn of TMS-oxygen plasma-polymerized PET substrates at higher discharge powers, while the wear test of 300 cycles at 300 g loading with a steel wool was applied. The performance of wear resistance on PET substrates was found to be strongly dependent on the surface characteristics of PET substrates. The surface hardness of PET substrates was determined by the pencil test. The surface morphology of PET substrate was observed by atomic force microscopy (AFM). The atomic compositions and chemical bondings of TMS-oxygen plasma-polymerized organosilicas were analyzed by means of X-ray photoelectron spectroscopy (XPS). (C) 2008 Wiley Periodicals, Inc. J Appl Polym Sci 110: 2704-2710, 2008
机译：对透明有机二氧化硅（SiOxCy）在柔性透明聚对苯二甲酸乙二醇酯（PET）基材上进行等离子体聚合以提高耐磨性进行了研究。经证明，在室温（23摄氏度）下，具有四甲基硅烷（TMS）和氧气（02）气体的等离子聚合SiOxCy可以从未处理的PET基材完全磨损到等离子聚合的TMS-氧气完全磨损，大大提高耐磨性。在较高放电功率下使用PET基材，同时在300 g负载下用钢丝棉进行了300次循环的磨损测试。发现在PET基底上的耐磨性能在很大程度上取决于PET基底的表面特性。通过铅笔测试确定PET基材的表面硬度。通过原子力显微镜（AFM）观察PET基材的表面形态。通过X射线光电子能谱（XPS）分析了TMS-氧等离子体聚合的有机硅的原子组成和化学键。 （C）2008 Wiley Periodicals，Inc. J Appl Polym Sci 110：2704-2710，2008

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号