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Synthesis and characterization of chiral polyacrylates and their applications as positive tone photoresists

机译：手性聚丙烯酸酯的合成，表征及其作为正性光刻胶的应用

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摘要

To estimate the effects of diastereomeric copolymers as photoresists, diastereomeric copolymers containing chiral and racemic bornyl methacrylates (BMAs) were synthesized. Both alicyclic BMAs were synthesized from (-)-borneol and (+/-)-borneol, and then copolymerized with t-butyl methacrylate (t-BMA), tetrahydro-pyranyl methacrylate (THPMA), and alpha-methacryloxy-gamma-butyrolactone (MABL). The glass transition temperature of the copolymers was found to increase with an increase in the content of alicyclic bornyl groups in the copolymers. To investigate the effect of both the alicyclic butyrolactone and the bornyl groups on photosensitivity, thermal property, and etching resistance, the synthesized alicyclic copolymers were used to prepare photoresists with photoacid generators. The sensitivity and the contrast of the photoresists were calculated. This investigation demonstrated that the existence of alicyclic butyrolactone and bornyl groups increases the etching resistance of photoresists. It was also found that high stereo hindered bornyl structures disturb and restrict the mobility of the polymer chain, leading to an increase in the thermal stability of the polymers. A real pattern recording of photoresists with PR3 composition was performed; an optimal sensitivity of 20 mJ/cm(2) and resolution of I pm of positive tone photoresists with I pm thickness was achieved. (c) 2008 Wiley Periodicals, Inc. J Appl Polym Sci 109: 3776-3785,2008.
机译：为了评估非对映共聚物作为光致抗蚀剂的作用，合成了含有手性和外消旋甲基丙烯酸冰片烯酯（BMA）的非对映共聚物。两种脂环族BMA均由（-）-冰片和（+/-）-冰片合成，然后与甲基丙烯酸叔丁酯（t-BMA），甲基丙烯酸四氢吡喃基酯（THPMA）和α-甲基丙烯酰氧基-γ-丁内酯共聚（MABL）。发现共聚物的玻璃化转变温度随着共聚物中脂环式冰片基的含量的增加而增加。为了研究脂环族丁内酯和冰片基团对光敏性，热性能和耐蚀性的影响，将合成的脂环族共聚物用于制备具有光酸产生剂的光刻胶。计算了光致抗蚀剂的灵敏度和对比度。该研究表明脂环族丁内酯和冰片基的存在增加了光刻胶的耐蚀刻性。还发现高立体位受阻的冰片烷基结构干扰并限制了聚合物链的迁移率，导致聚合物的热稳定性增加。进行具有PR3组成的光刻胶的真实图案记录;获得了20 mJ / cm（2）的最佳灵敏度和具有I pm厚度的正性光刻胶的I pm分辨率。 （c）2008 Wiley Periodicals，Inc. J Appl Polym Sci 109：3776-3785，2008。

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