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Effect of Silane Coupling Agent on Swelling Behaviors and Mechanical Properties of Thermosensitive Hybrid Gels

机译:硅烷偶联剂对热敏杂化凝胶的溶胀行为和力学性能的影响

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A series of organic-inorganic hybrid thermosensitive,gels with three different structures were prepared from N-isopropylacrylamide (NIPAAm), and N, N'-methylenebisacrylamide (NMBA) and tetraethoxysilane (TEOS) [N-IPN]; NIPAAm 3-(trimethoxysilyl) propyl methacrylate (TMSPMA) as coupling agent and TEOS [NT-IPN]; and NIPAAm, TMSPMA, and TEOS [NT-semi-IPN] by emulsion polymerization and sol-gel reaction in this study,. The effect of different gel structures and coupling agent oil the swelling behavior, mechanical properties, and morphologies of the present gels was investigated. Results showed that the properties of the gels would be affected by the gel networks such is IPN or semi-IPN and with or without existence of TMSPMA as the bridge chain between networks. The NT-semi-IPN gel had higher swelling ratio and faster diffusion rate because poly(NIPAAm) moiety in the semi-IPN gels was not restricted by NMBA network. However, the IPN gels such as N-IPN and NT-IPN had good mechanical properties and lower swelling ratio, but had a poor thermosensitivity due to the addition of coupling agent, TMSPMA, into the gel system that resulted in denser link between organic and inorganic components. The morphology showed that IPN gels had partial aggregation (siloxane domain) and showed some denser phases. (c) 2008 Wiley Periodicals, Inc. J Appl Polym Sci 111: 2025-2034, 2009
机译:由N-异丙基丙烯酰胺(NIPAAm),N,N'-亚甲基双丙烯酰胺(NMBA)和四乙氧基硅烷(TEOS)[N-IPN]制备了一系列具有三种不同结构的有机-无机杂化热敏凝胶。 NIPAAm 3-(三甲氧基甲硅烷基)甲基丙烯酸丙酯(TMSPMA)作为偶联剂和TEOS [NT-IPN];在本研究中,通过乳液聚合和溶胶-凝胶反应制备了NIPAAm,TMSPMA和TEOS [NT-semi-IPN]。研究了不同凝胶结构和偶联剂对本凝胶的溶胀行为,机械性能和形态的影响。结果表明,凝胶的性质会受到凝胶网络(如IPN或半IPN)的影响,以及是否存在TMSPMA作为网络之间的桥链。 NT-semi-IPN凝胶具有更高的溶胀率和更快的扩散速率,因为半IPN凝胶中的poly(NIPAAm)部分不受NMBA网络的限制。但是,IPN凝胶(例如N-IPN和NT-IPN)具有良好的机械性能和较低的溶胀率,但由于在凝胶体系中添加了偶联剂TMSPMA,导致有机溶剂与有机溶剂之间的紧密连接,热敏性较差。无机成分。形态表明,IPN凝胶具有部分聚集(硅氧烷结构域)并显示出一些致密相。 (c)2008 Wiley Periodicals,Inc. J Appl Polym Sci 111:2025-2034,2009

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