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首页> 外文期刊>Journal of Applied Polymer Science >Curing Behavior and Thermal Properties of Trifunctional Epoxy Resin Cured by 4,4 '-Diaminodiphenylmethane
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Curing Behavior and Thermal Properties of Trifunctional Epoxy Resin Cured by 4,4 '-Diaminodiphenylmethane

机译：4,4'-二氨基二苯甲烷固化的三官能团环氧树脂的固化行为和热性能

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摘要

A novel trifunctional epoxy resin (TMBPBTH-EPOXY) was synthesized in our laboratory, and its curing behavior and performance were studied by curing with 4,4'-diaminodiphenylmethane (DDM) with the mass ratio of 30 : 100 of TMBPBTH-EPOXY and DDM. The mixtures of TMBPBTH-EPOXY/DDM were cured at 100, 140, and 160 degrees C, respectively. The curing state was kept for different time from I to 6 h. The transition reaction of epoxide group during curing process was monitored by Fourier transform infrared spectroscopy. It was found that curing reaction was both dependent on the curing temperature and curing time, and the curing temperature has more effect on the curing reaction than the curing time. The curing activation energy was investigated by differential scanning calorimetry to be 55.13 and 55.10 kJ/mol. The glass transition temperature of TMBPBTH-EPOXY/DDM system was 240.2 degrees C. The thermal decomposition temperature at different temperatures and time were studied by thermogravimetric analyzer.
机译：在我们的实验室中合成了一种新型的三官能环氧树脂（TMBPBTH-EPOXY），并通过以4：4'-二氨基二苯基甲烷（DDM）与TMPBBTH-EPOXY和DDM的质量比为30：100进行固化，研究了其固化行为和性能。 。 TMBPBTH-EPOXY / DDM的混合物分别在100、140和160摄氏度下固化。保持固化状态1到6小时。用傅里叶变换红外光谱法监测固化过程中环氧基的转变反应。发现固化反应与固化温度和固化时间均有关，并且固化温度比固化时间对固化反应的影响更大。通过差示扫描量热法研究固化活化能为55.13和55.10kJ / mol。 TMBPBTH-EPOXY / DDM系统的玻璃化转变温度为240.2摄氏度。使用热重分析仪研究了不同温度和时间下的热分解温度。

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