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Fabrication and Properties of Solution-Cast Polyaniline/Carboxymethylchitin Blend Films

机译:溶液铸型聚苯胺/羧甲基甲壳素共混膜的制备与性能

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摘要

Blend films consisting of polyaniline in emeraldine base form (PANT EB) dispersed in partially crosslinked carboxymethylchitin (CM-chitin) were prepared by solution casting, and characterized for their physical, thermal, and electrical properties. Homogeneous and mechanically robust blend films were obtained having PANT EB contents up to 50 wt % in the CM-chitin matrix. FTIR spectra confirm intimate mixing of the two blend components. The thermal stability of the blend films increased with increase of PANT EB content, suggesting the formation of an intermolecular interaction, such as hydrogen bonding, between PANT EB and CM-chitin chains. The addition of PANT EB into the pure CM-chitin film resulted in a decrease in electrical conductivity of the films owing to disruption of ionic conduction of the CM-chitin structure. After doping the blend films by immersion in HCl solution, the electrical conductivity of the HCl-doped films increased with increase of the PANT EB content to a maximum value of the order of 10(-3) S/cm at 50 wt % PANT EB content. The electrical conductivity of the blend films was also dependent on the HCl concentration as well as on the type of acid dopant.
机译:通过溶液流延制备由翡翠碱形式的聚苯胺(PANT EB)分散在部分交联的羧甲基甲壳素(CM-甲壳素)中组成的共混膜,并对其物理,热和电性能进行表征。获得了在CM-几丁质基质中具有高达50重量%的PANT EB含量的均质且机械坚固的共混膜。 FTIR光谱证实了两种共混物组分的紧密混合。共混膜的热稳定性随PANT EB含量的增加而增加,这表明PANT EB与CM-几丁质链之间形成了分子间相互作用,例如氢键。由于破坏了CM-几丁质结构的离子传导,将PANT EB添加到纯CM-几丁质膜中导致膜的电导率降低。在通过浸入HCl溶液中掺杂共混膜之后,随着PANT EB含量的增加,在50 wt%PANT EB处,HCl掺杂膜的电导率增加,最大值达到10(-3)S / cm内容。共混膜的电导率还取决于HCl浓度以及酸掺杂剂的类型。

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