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首页> 外文期刊>Journal of Applied Polymer Science >Nonisothermal curing of a solid resole phenolic resin
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Nonisothermal curing of a solid resole phenolic resin

机译：固体甲阶酚醛树脂的非等温固化

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摘要

A commercial solid resole phenolic resin was thoroughly characterized with Fourier transform infrared spectroscopy, NMR, and gel permeation chromatography, and its nonisothermal curing reaction was studied systematically with differential scanning calorimetry at a series of heating rates (βs) of 3, 4.5, 5.7, and 10°C/min. The results show that the solid resole had a higher molecular weight than conventional liquid resoles, and its reactive hydroxymethyl (CH_2?￡?OH) and dibenzyl ether (CH_2?￡?O?￡?CH_2) functionalities participated in the crosslinking reaction upon heating. The nonisothermal curing reaction of the solid resole exhibited a relatively constant reaction heat, whereas the onset, peak, and end curing temperatures increased gradually with increasing βs. In addition, the reaction kinetics of the solid resole was analyzed with an nth-order reaction model, the global activation energy was determined with the Kissinger method, and the reaction order was derived from the Crane equation. The obtained rate equation was applied to simulate the reaction time, conversion, and reaction rate, with a good fit achieved between the experimental data and the model predications. In conclusion, this study provided us with new knowledge on solid resoles at a molecular level and was also a great help for the curing procedure design, property optimization, and practical application of this commercial solid resole.
机译：用傅里叶变换红外光谱，NMR和凝胶渗透色谱法对商用固体甲阶酚醛树脂进行了全面表征，并用差示扫描量热法在一系列加热速率（βs）为3、4.5、5.7，和10°C / min。结果表明，固体甲阶酚醛树脂的分子量比常规的液态甲阶酚醛树脂高，并且其反应性羟甲基（CH_2→3→OH）和二苄基醚（CH_2→3→O→3→CH_2）的官能团参与了加热时的交联反应。 。固体甲阶酚醛树脂的非等温固化反应显示出相对恒定的反应热，而起始，峰值和最终固化温度随βs的增加而逐渐增加。另外，用n阶反应模型分析了固体甲阶酚醛的反应动力学，用Kissinger方法确定了整体活化能，并从Crane方程推导了反应顺序。将获得的速率方程式用于模拟反应时间，转化率和反应速率，并且在实验数据和模型预测之间实现了很好的拟合。总而言之，这项研究为我们提供了有关分子水平的固体甲阶酚醛树脂的新知识，也为该商业固体甲阶酚醛树脂的固化程序设计，性能优化和实际应用提供了极大帮助。

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