首页> 外文期刊>Journal of Applied Polymer Science >Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Substrate by Scratch Tests
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Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Substrate by Scratch Tests

机译:通过刮擦试验定量研究SU-8光刻胶与金属基材之间的粘合强度

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摘要

During the manufacturing process of metal microstructures and microdevices by SU-8 ultraviolet-lithographie, galanoformung and abformung (UV-LIGA) technology, interfacial delamination and bond failure are common because of the poor adhesion strength between the SU-8 photoresist and the metal substrate. In this study, a scratch method was used to measure the adhesion strength between the SU-8 and the metal substrate. A simulation of a scratch test process was accomplished on the basis of the finite element method, and a modified empirical formula that accounted for local horizontal stress was deduced by a dimensional analysis method. The good agreement among the calculated formula, corresponding simulant, and experimental results showed the validity of the modified empirical formula. Interfacial adhesion work was also obtained to characterize the interfacial adhesion properties. This study provided a theoretical basis for quantitatively estimating the interfacial adhesion strength and a theoretical foundation for improving the interfacial adhesion properties.
机译:在SU-8紫外平版印刷,加拉诺福ung和abformung(UV-LIGA)技术制造金属微结构和微器件的过程中,由于SU-8光刻胶与金属基板之间的粘合强度较差,界面脱层和键合失效很常见。 。在这项研究中,使用刮擦法测量SU-8与金属基材之间的粘合强度。在有限元方法的基础上完成了划痕测试过程的仿真,并通过尺寸分析方法推导了解释局部水平应力的改进经验公式。计算公式,相应的模拟量和实验结果之间的良好一致性证明了改进的经验公式的有效性。还获得了界面粘合作用以表征界面粘合性质。该研究为定量估计界面粘合强度提供了理论基础,为改善界面粘合性能提供了理论基础。

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