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首页> 外文期刊>Journal of Applied Polymer Science >Electrospun Heat Management Polymeric Materials of Interest in Food Refrigeration and Packaging
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Electrospun Heat Management Polymeric Materials of Interest in Food Refrigeration and Packaging

机译：食品冷藏和包装中关注的电纺热管理聚合物材料

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摘要

The use of latent heat storage materials using phase change materials (PCMs) is an effective way of buffering thermal fluctuations and has the advantages of high-energy storage density and the isothermal nature of the storage process. The aim of this work was to develop slabs with energy storage capacity for their application in refrigerated foods. To this end, polycaprolactone (PCL) and polystyrene (PS) were used as encapsulating matrices of a PCM, specifically RT5 (a paraffin which has a transition temperature at 5℃), by using electrohydrodynamic processing. The effect of storage temperature (4℃ and 25℃) and time on the morphology and thermal characteristics of the PCL/RT5 and PS/RT5 slabs was evaluated. Results showed that RT5 can be properly encapsulated inside both polymers, although PCL provided better encapsulation efficiency. Encapsulation efficiency was affected not only by the polymer matrix but also by storage time at 25℃. The greatest encapsulation efficiency (98.6%) and optimum heat management performance was achieved for PCL/PCM slabs stored at 4℃, corresponding to materials composed of ~44 wt % of PCM (core material) and ~56 wt % of the PCL shell material. These temperature buffering materials can be of great interest to preserve the quality of packaged foods and to increase efficiency and reduce energy consumption in refrigeration equipment.
机译：使用相变材料（PCM）的潜热存储材料是缓冲热波动的有效方法，并且具有高能量存储密度和存储过程的等温特性的优点。这项工作的目的是开发具有储能能力的平板，将其用于冷藏食品中。为此，使用聚己内酯（PCL）和聚苯乙烯（PS）作为PCM的封装基质，特别是RT5（转变温度为5℃的石蜡），采用电液动力学方法。评估了储存温度（4℃和25℃）和时间对PCL / RT5和PS / RT5板的形态和​​热特性的影响。结果显示，尽管PCL提供了更好的封装效率，但RT5可以正确地封装在两种聚合物中。包封效率不仅受聚合物基质的影响，还受25℃保存时间的影响。储存在4℃的PCL / PCM平板具有最高的封装效率（98.6％）和最佳的热管理性能，对应于约44 wt％的PCM（核心材料）和约56 wt％的PCL外壳材料。这些温度缓冲材料对于保持包装食品的质量，提高效率并减少制冷设备的能耗可能非常重要。

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