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首页> 外文期刊>Journal of Applied Polymer Science >The study of char forming on OPS/PC and DOPO-POSS/PC composites
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The study of char forming on OPS/PC and DOPO-POSS/PC composites

机译：在OPS / PC和DOPO-POSS / PC复合材料上形成炭的研究

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摘要

Polyhedral oligomeric octaphenyl silsesquioxane (OPS) and polyhedral oligomeric silsesquioxane containing 9,10-dihydro-9-oxa-10-phosphaphenanthrene- 10-oxide (DOPO-POSS) with polycarbonate (PC) were each prepared by twin screw extrusion. Their flammability was studied by cone calorimetry under different heat fluxes (35 and 50 kW/m~2). In the cone calorimeter testing, thermocouples were used to measure the temperature at the top and bottom of the composites. Compared to the DOPO-POSS/PC composite, the char layer of the OPS/PC composite is better for preventing heat transfer, the temperature change indicates that OPS/PC composite has a longer period of char formation, and the organization of their char materials are different. The DOPO-POSS/PC composite has a harder char layer than the OPS/PC composite, but the OPS/PC composite char layer is more compact. The char layer macrostructure was studied with scanning electron microscopy (SEM) and EDS, which indicated that there are many bubbles and pores in the DOPO-POSS/PC composite. EDS showed that there was some Si content in the exterior and interior char for the DOPO-POSS/PC composite; there is a greater Si content in the exterior OPS/PC char residue than in the interior. The storage modulus of OPS/PC composite was higher than the PC control and DOPO-POSS/PC composite at low frequencies. The values of η* of the OPS/PC composite were higher than the PC control and DOPO-POSS/PC composite at low frequencies; also, the PC control exhibits a quasi-Newtonian regime, but the OPS/PC and DOPO-POSS/PC composites exhibit typical shear-thinning behavior.
机译：通过双螺杆挤出分别制备多面体低聚八苯基倍半硅氧烷（OPS）和含有9，10-二氢-9-氧杂-10-磷酸菲并具有10-氧化物（DOPO-POSS）的多面体低聚倍半硅氧烷。通过锥形量热法在不同热通量（35和50 kW / m〜2）下研究了它们的可燃性。在锥形量热仪测试中，热电偶用于测量复合材料顶部和底部的温度。与DOPO-POSS / PC复合材料相比，OPS / PC复合材料的炭层更好地防止了热传递，温度变化表明OPS / PC复合材料的炭形成时间更长，并且炭材料的组织是不同的。 DOPO-POSS / PC复合材料的炭层比OPS / PC复合材料的炭层硬，但是OPS / PC复合材料的炭层更紧凑。通过扫描电子显微镜（SEM）和EDS对炭层的宏观结构进行了研究，结果表明，DOPO-POSS / PC复合材料中存在许多气泡和孔洞。 EDS显示，DOPO-POSS / PC复合材料的外部和内部炭中都含有一定的Si含量。与外部相比，外部OPS / PC炭残留物中的Si含量更高。 OPS / PC复合材料在低频下的储能模量高于PC对照和DOPO-POSS / PC复合材料。在低频下，OPS / PC复合材料的η*值高于PC对照和DOPO-POSS / PC复合材料的η*值;同样，PC控制表现出准牛顿状态，但OPS / PC和DOPO-POSS / PC复合材料表现出典型的剪切稀化行为。

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