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首页> 外文期刊>Journal of Applied Polymer Science >Chemical Phosphorylation Improves the Moisture Resistance of Soy Flour-Based Wood Adhesive
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Chemical Phosphorylation Improves the Moisture Resistance of Soy Flour-Based Wood Adhesive

机译：化学磷酸化提高了基于大豆粉的木材胶粘剂的耐湿性

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摘要

A green-chemistry approach to improve the moisture resistance of soy flour (SF)-based wood adhesive is described. Chemical phosphorylation of SF (PSF), using POCl_3 as the phosphorylating agent, dramatically increased its wet bond strength. The optimum POCl_3:SF ratio that produced maximum wet bond strength was about 0.15 (g g~(-1)). The increase in wet bond strength of PSF (PSF0.15) was mostly due to the phosphate groups incorporated into the proteins and carbohydrates, and to a lesser degree to phosphorylation-induced protein denaturation. The attached phosphate groups acted as cross-linking agents, either via covalent esterification with hydroxyl groups on wood chips or via ionic and hydrogen-bonding interactions with functional groups in wood chips. At hot-press temperatures above 160℃ the wet bond strength of PSF0.15 was >2.6 MPa, a level that might be acceptable for interior-used hardwood plywood and particleboard. POCl_3 is a low cost, general-purpose reagent and therefore PSF-based adhesive is expected to be environmentally friendly.
机译：描述了一种绿色化学方法，用于改善基于大豆粉（SF）的木材粘合剂的耐湿性。使用POCl_3作为磷酸化剂的SF（PSF）的化学磷酸化极大地提高了其湿粘合强度。产生最大湿粘合强度的最佳POCl_3：SF比约为0.15（g g〜（-1））。 PSF（PSF0.15）的湿粘合强度的增加主要是由于结合到蛋白质和碳水化合物中的磷酸基团，以及磷酸化诱导的蛋白质变性的程度较小。通过与木片上的羟基共价酯化或通过与木片上官能团的离子键和氢键相互作用，所连接的磷酸酯基充当交联剂。在高于160℃的热压温度下，PSF0.15的湿粘合强度> 2.6 MPa，该水平对于室内使用的硬木胶合板和刨花板是可以接受的。 POCl_3是一种低成本的通用试剂，因此，基于PSF的胶粘剂有望实现环保。

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