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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn-3.5Ag-0.7Cu solder joint
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Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn-3.5Ag-0.7Cu solder joint

机译：浸银表面处理对Sn-3.5Ag-0.7Cu焊点界面反应和机械可靠性的影响

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摘要

In this study, we investigated the interfacial reaction and joint reliability of immersion Ag-plated Cu substrate with the most promising Sn-3.5Ag-0.7Cu solder. We first evaluated the interfacial reactions of the solder joint and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. During reflow, the Ag plating layer was dissolved completely into the molten Sn-Ag-Cu solder and some of the Cu layer was also dissolved into the molten solder. The dissolved Ag and Cu were precipitated as Ag_3Sn and Cu_6Sn_5 IMCs in the solder matrix. Upon reflow, the Sn-Ag-Cu solder exhibits an off-eutectic reaction to produce the eutectic phase and precipitate (Cu_6Sn_5 and Ag_3Sn). The Cu-Sn IMC layer was formed at the solder/Cu interface after reflow and the IMC layer grew during aging treatment. During the shear tests, the failure mode switched from a bulk-related failure to an interface-related failure. After aging for 500 h, the joint failed partially at the solder/Cu_6Sn_5 interface. The brittle fracture was linked to the formation of thick Cu-Sn IMC layer.
机译：在这项研究中，我们研究了浸入式镀银铜基板与最有前途的Sn-3.5Ag-0.7Cu焊料的界面反应和接头可靠性。我们首先评估了焊点的界面反应，并成功地揭示了界面反应行为与机械可靠性之间的联系。在回流期间，Ag镀层完全溶解在熔融的Sn-Ag-Cu焊料中，并且一些Cu层也溶解在熔融的焊料中。溶解的Ag和Cu以Ag_3Sn和Cu_6Sn_5 IMC的形式沉淀在焊料基质中。回流时，Sn-Ag-Cu焊料表现出非共晶反应，从而产生共晶相并沉淀（Cu_6Sn_5和Ag_3Sn）。回流后在焊料/ Cu界面处形成Cu-Sn IMC层，并且在时效处理期间IMC层会生长。在剪切测试期间，故障模式从与体积相关的故障切换为与界面相关的故障。老化500小时后，接头在焊料/ Cu_6Sn_5界面处部分失效。脆性断裂与厚的Cu-Sn IMC层的形成有关。

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