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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Effect of addition of nano-copper and extrusion temperature on the microstructure and mechanical response of tin
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Effect of addition of nano-copper and extrusion temperature on the microstructure and mechanical response of tin

机译：纳米铜的添加和挤压温度对锡组织和力学响应的影响

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摘要

In the present study, 0.35 and 1.1 vol.% of nano-size copper were incorporated into pure tin using hybrid microwave sintering assisted powder metallurgy route. Microwave sintered samples were extruded both at room temperature and at 230 °C. Microstructural characterization studies were conducted on the extruded samples to investigate the distribution characteristics of secondary phase, grains and pores morphology. Resistivity of solder samples was also investigated and found to be not affected by the high temperature extrusion. Room temperature tensile test results revealed that hot extruded Sn-Cu samples exhibited higher strengths and ductility when compared to room temperature extruded samples. On the contrary, the tensile properties of pure tin remained independent of extrusion temperature. An attempt is made in this study to correlate the presence of copper and effect of extrusion temperature on the microstructural evolution and mechanical response of tin.
机译：在本研究中，采用混合微波烧结辅助粉末冶金法将0.35％和1.1％（体积）的纳米级铜掺入纯锡中。微波烧结的样品在室温和230℃下均被挤出。对挤压样品进行了微结构表征研究，以研究次生相的分布特征，晶粒和孔的形态。还研究了焊料样品的电阻率，发现不受高温挤压的影响。室温拉伸试验结果表明，与室温挤压样品相比，热挤压Sn-Cu样品表现出更高的强度和延展性。相反，纯锡的拉伸性能保持与挤出温度无关。本研究试图将铜的存在与挤压温度对锡的微观组织演变和机械响应的影响相关联。

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