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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In
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Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In

机译：通过添加少量的Ag和In开发出高强度的Sn-0.7Cu焊料

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摘要

Nowadays, a major concern of Sn-Cu based solder alloys is focused on continuously improving the comprehensive properties of solder joints formed between the solders and substrates. In this study, the influence of Ag and/or In doping on the microstructures and tensile properties of eutectic Sn-0.7Cu lead free solder alloy have been investigated. Also, the effects of temperature and strain rate on the mechanical performance of Sn-0.7Cu, Sn-0.7Cu-2Ag, Sn-0.7Cu-2In and Sn-0.7Cu-2Ag-2In solders were investigated. The tensile tests showed that while the ultimate tensile strength (UTS) and yield stress (YS) increased with increasing strain rate, they decreased with increasing temperature, showing strong strain rate and temperature dependence. The results also revealed that with the addition of Ag and In into Sn-0.7Cu, significant improvement in YS (~255%) and UTS (~215%) is realized when compared with the other commercially available Sn-0.7 wt. % Cu solder alloys. Furthermore, the Sn-0.7Cu-2Ag-2In solder material developed here also exhibits higher ductility and well-behaved mechanical performance than that of eutectic Sn-0.7Cu commercial solder. Microstructural analysis revealed that the origin of change in mechanical properties is attributed to smaller beta-Sn dendrite grain dimensions and formation of new inter-metallic compounds (IMCs) in the ternary and quaternary alloys.
机译：如今，Sn-Cu基焊料合金的主要关注点在于不断改善在焊料和基材之间形成的焊点的综合性能。在这项研究中，研究了Ag和/或In掺杂对共晶Sn-0.7Cu无铅焊料合金的组织和拉伸性能的影响。此外，研究了温度和应变速率对Sn-0.7Cu，Sn-0.7Cu-2Ag，Sn-0.7Cu-2In和Sn-0.7Cu-2Ag-2In焊料的机械性能的影响。拉伸试验表明，虽然极限拉伸强度（UTS）和屈服应力（YS）随应变速率的增加而增加，但随温度升高而降低，表现出很强的应变速率和温度依赖性。结果还表明，与其他市售Sn-0.7 wt。相比，在Sn-0.7Cu中添加Ag和In可以显着改善YS（〜255％）和UTS（〜215％）。 ％Cu焊料合金。此外，这里开发的Sn-0.7Cu-2Ag-2In焊料比共晶Sn-0.7Cu商业焊料还具有更高的延展性和良好的机械性能。显微组织分析表明，机械性能变化的起因归因于较小的β-Sn枝晶晶粒尺寸以及三元和四元合金中新的金属间化合物（IMC）的形成。

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