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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Transient liquid phase bonding of carbon steel tubes using a Cu interlayer: Characterization and comparison with amorphous Fe-B-Si interlayer bonds
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Transient liquid phase bonding of carbon steel tubes using a Cu interlayer: Characterization and comparison with amorphous Fe-B-Si interlayer bonds

机译：使用铜夹层的碳钢管的瞬态液相键合：表征和与非晶态Fe-B-Si夹层键的比较

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摘要

In the present work the transient liquid phase bonding process was performed to join seamless carbon steel tubes using commercially pure Cu interlayers. The structural and mechanical characteristics of the resulting bonds are compared with those achieved using amorphous Fe-B-Si interlayers, under the same process parameters: a holding temperature of 1300℃, a holding time of 7 min and an applied pressure of 5 MPa. The joined tubes microstructures were characterized by direct observations - scanning electron microscopy - and diffraction techniques - electron backscatter diffraction. Chemical analysis was performed using electron probe microanalysis. Whereas the amorphous Fe-B-Si interlayer leads to a completion of the bonding process over the whole bonding area, the bond performed using a Cu interlayer achieved the completion of the bonding process only partially. As the Cu is a cementite promoter, the amount of cementite coexisting with ferrite grains is higher in the joint region (JR) - corresponding to the higher concentration of Cu - as compared with the heat affected zone (HAZ) and the base metal (BM). An opposite effect is observed when using Fe-B-Si interlayers due to the fact that the cementite is unable to form in Si enriched zones - the microstructure at the JR presents only ferrite grains. Tensile tests show that the joined tubes using Cu or Fe-B-Si interlayers failed away from the bond, at the HAZ, attaining almost the same ultimate tensile strength of the BM, in the as-received condition. Hardness profiles across the bonding zone are in agreement with the observed microstructures at the different zones of the bond region.
机译：在本工作中，使用商业上纯的Cu中间层进行了瞬态液相键合工艺，以连接无缝碳钢管。在相同的工艺参数下，将得到的键的结构和机械特性与使用非晶态Fe-B-Si夹层获得的键的结构和机械特性进行比较：保持温度1300℃，保持时间7分钟，施加压力5 MPa。通过直接观察-扫描电子显微镜-衍射技术-电子背散射衍射来表征连接管的微观结构。使用电子探针微分析进行化学分析。尽管非晶Fe-B-Si中间层导致在整个键合区域上完成键合过程，但使用Cu中间层进行的键合仅部分完成了键合过程。由于Cu是渗碳体促进剂，因此与热影响区（HAZ）和贱金属（BM）相比，在结合区（JR）中与铁素体晶粒共存的渗碳体含量更高-对应于较高的Cu浓度。 ）。当使用Fe-B-Si夹层时观察到相反的效果，这是由于渗碳体无法在富Si的区域中形成的事实-JR处的显微组织仅呈现铁素体晶粒。拉伸试验表明，使用Cu或Fe-B-Si中间层的连接管在热影响区处无法脱离结合，在所接受的条件下获得的拉伸强度几乎与BM相同。整个结合区的硬度分布与在结合区的不同区域观察到的微观结构一致。

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