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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection
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Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

机译：Au-Pt-Sn系统的热力学重新评估和（AuSn）eut-Pt互连的微观结构演变

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The Calphad method has been employed to reassess the thermodynamic description of the Au-Pt-Sn ternary system by remodeling the ternary compound and the solubility of the third elements in relevant binary compounds. A set of consistent parameters was obtained with reproducing most of the experimental results. The microstructures of as-soldered and aged Au-20 wt%Sn vertical bar Pt reaction couples were characterized by using scanning electron microscopy with energy-dispersive X-ray microanalysis (EDS), as well as scanning transmission electron microscopy with EDS. During soldering, the (Au1-x,Pt-x)Sn (0 <= x <= 0.5) intermetallic compound layer was formed at solder/ Pt interface and evolved with prolonged bonding time. When the as-soldered samples were subsequently annealed at 150 degrees C for up to 4600 h, only one interfacial intermetallic compound (Au1-x,Pt-x)Sn was observed. The average thickness of the (Au1-x,Pt-x)Sn layer was reached similar to 3.3 mu m already after 100 h of aging and remained practically constant with the progress of the aging process. When samples were isothermally aged for 6848 h, in addition to the thick (Au1-x, Pt-x)Sn interfacial layer, a thin (no more than 100 nm) PtSn layer was observed at the interface of (Au1-x,Pt-x)Sn/Pt. These results indicate that the Au-20 wt%Sn vertical bar Pt interconnections are thermally stabile at 150 degrees C. The interfacial reaction mechanism of Au-20 wt%Sn vertical bar Pt at 150 degrees C has been proposed by combining experimental results with the basic thermodynamic considerations. Moreover, the microstructure of Au-20 wt%Sn vertical bar Pt was compared with those of Au-20 wt%Sn vertical bar Ni and Au-20 wt%Sn vertical bar Cu. The advantages and disadvantages of Au-20 wt% Sn solder on Ni, Cu and Pt contact metallizations were discussed. (C) 2016 Elsevier B.V. All rights reserved.
机译：通过重塑三元化合物和第三元素在相关二元化合物中的溶解度，已采用Calphad方法重新评估Au-Pt-Sn三元系统的热力学描述。获得了一组一致的参数，并再现了大多数实验结果。通过使用具有能量色散X射线显微分析（EDS）的扫描电子显微镜以及具有EDS的透射电子显微镜，对已焊接和老化的Au-20 wt％Sn垂直棒Pt反应对的显微组织进行了表征。在焊接过程中，（Au1-x，Pt-x）Sn（0 <= x <= 0.5）金属间化合物层在焊料/ Pt界面形成，并随着键合时间的延长而析出。随后将焊好的样品在150摄氏度下退火4600 h，仅观察到一种界面金属间化合物（Au1-x，Pt-x）Sn。老化100小时后，（Au1-x，Pt-x）Sn层的平均厚度已接近3.3微米，并且随着老化过程的进行而实际上保持恒定。将样品等温老化6848小时后，除了厚的（Au1-x，Pt-x）Sn界面层之外，在（Au1-x，Pt）的界面上还观察到了薄的（不超过100 nm）PtSn层。 -x）Sn / Pt。这些结果表明Au-20 wt％Sn垂直棒Pt互连在150摄氏度时是热稳定的。通过结合实验结果和Au-20 wt％Sn垂直棒Pt在150摄氏度时的界面反应机理已经提出。基本的热力学考虑。此外，将Au-20wt％Sn垂直棒Pt的显微组织与Au-20wt％Sn垂直棒Ni和Au-20wt％Sn垂直棒Cu的显微组织进行了比较。讨论了Au-20 wt％Sn焊料在Ni，Cu和Pt接触金属上的优缺点。 （C）2016 Elsevier B.V.保留所有权利。

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