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首页> 外文期刊>Journal of nanoscience and nanotechnology >Annealing Dependence of Solution-Processed Ultra-Thin ZrOx Films for Gate Dielectric Applications
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Annealing Dependence of Solution-Processed Ultra-Thin ZrOx Films for Gate Dielectric Applications

机译:栅极电介质应用固溶处理的超薄ZrOx薄膜的退火依赖性

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摘要

Ultra-thin ZrOx thin films on Si substrates were prepared by sol-gel technique and processed with different methods (baked on hot plate at 150 degrees C, annealed at 500 degrees C in furnace, and photoannealed under UV light). The decomposition of the organic groups and the formation of Zr-O bonding in the ZrOx thin films were confirmed by Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. It is found that the ZrOx thin film annealed under UV light shows decent characteristics, including an ultra-small surface roughness, a low leakage current density of 10(-9) A/cm(2) at 1 MV/cm, a large breakdown electric field of 9.5 MV/cm, and a large areal capacitance of 775 nF/cm(2).
机译:通过溶胶-凝胶技术在硅衬底上制备超薄ZrOx薄膜,并用不同的方法进行处理(在150摄氏度的热板上烘烤,在炉中于500摄氏度退火,并在紫外线下进行光退火)。 ZrOx薄膜中有机基团的分解和Zr-O键的形成已通过傅里叶变换红外光谱和X射线光电子能谱得以证实。发现在紫外线下退火的ZrOx薄膜表现出良好的特性,包括超小的表面粗糙度,在1 MV / cm的情况下低的漏电流密度10(-9)A / cm(2),大的击穿电场为9.5 MV / cm,面积电容为775 nF / cm(2)。

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