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首页> 外文期刊>Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites >Investigation of the microhardness and the electrical resistivity of undercooled Ni-10 at.% Si alloys
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Investigation of the microhardness and the electrical resistivity of undercooled Ni-10 at.% Si alloys

机译：过冷的Ni-10 at。％Si合金的显微硬度和电阻率研究

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摘要

Ni-10 at.% Si alloys (Ni and Si of purity of 99.99%) were prepared by arc melting method under argon atmosphere in a water-cooled copper hearth with a non-consumable tungsten electrode and titanium getter. Spherical-shaped Ni-10 at.% Si alloy melts are undercooled in a containerless electromagnetic levitation apparatus. The effects of undercooling (ΔT) on the microstructure, electrical resistivity (ρ) and microhardness (HV) were investigated. The experimental results reveal that with the increase of the undercooling of the melts from 16 to 110 K, the microstructures undergo transition from coarse dendritic morphology to ultra fine dendritic morphology. The measurements of microhardness of the samples were performed by using a microhardness test device. The dependence of microhardness on undercooling was analyzed and it has been found that with increasing the undercooling the HV increases. Variations of electrical resistivity of the Ni-10 at.% Si alloy with the temperature in the range of 300-800 K were also determined by using a standard d.c. four-point probe technique. The resistivity of samples increases with increasing temperature and undercooling.
机译：在氩气气氛下，在水冷的铜炉中，使用不消耗钨的电极和钛吸气剂，通过电弧熔化法制备了Ni-10 at。％Si合金（Ni和Si的纯度为99.99％）。球形Ni-10 at。％Si合金熔体在无容器电磁悬浮设备中过冷。研究了过冷度（ΔT）对组织，电阻率（ρ）和显微硬度（HV）的影响。实验结果表明，随着熔体过冷度从16 K增加到110 K，微观组织经历了从粗枝晶形态到超细枝晶形态的转变。样品的显微硬度的测量通过使用显微硬度测试装置进行。分析了显微硬度对过冷的依赖性，并且发现随着过冷的增加，HV增加。还通过使用标准d.c确定了Ni-10原子％Si合金的电阻率随温度在300-800K范围内的变化。四点探针技术。样品的电阻率随温度升高和过冷而增加。

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