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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Two-temperature thermodynamic and transport properties of SF6-Cu plasmas
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Two-temperature thermodynamic and transport properties of SF6-Cu plasmas

机译：SF6-Cu等离子体的两温热力学和输运性质

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摘要

SF6 and Cu are widely adopted in electrical equipment as a dielectric medium and for conductive components, respectively. SF6-Cu plasmas are frequently formed, particularly in high-voltage circuit breaker arcs and fault current arcs, due to erosion of the Cu components. In this paper, calculated values of the thermodynamic and transport properties of plasmas in SF6-Cu mixtures are presented for both thermal equilibrium and non-equilibrium conditions. The composition is determined by the two-temperature Saha equation and Guldberg-Waage equation in the form derived by van de Sanden. The composition and the thermodynamic properties are evaluated through a classical statistical mechanics approach. For the transport coefficients, the simplified Chapman-Enskog method developed by Devoto, which decouples the electrons and heavy species, has been applied using the most recent collision integrals. The thermodynamic and transport properties are calculated for different electron temperatures (300-40 000 K), ratios of electron to heavy-species temperature (1-10), pressures (0.1-10 atm) and copper molar proportions (0-50%). It is found that deviations from thermal equilibrium strongly affect the thermodynamic and transport properties of the SF6-Cu plasmas. Further, the presence of copper has different effects on some of the properties for plasmas in and out of thermal equilibrium. The main reason for these changes is that dissociation reactions are delayed for non-thermal equilibrium plasmas, which in turn influences the ionization reactions that occur.
机译：SF6和Cu在电气设备中分别广泛用作电介质和导电组件。由于铜组分的腐蚀，经常形成SF6-Cu等离子体，特别是在高压断路器电弧和故障电流电弧中。在本文中，给出了在热平衡和非平衡条件下，SF6-Cu混合物中等离子体的热力学和传输性质的计算值。组成由范德桑登（van de Sanden）导出的形式的两温Saha方程和Guldberg-Waage方程确定。通过经典的统计力学方法评估其组成和热力学性质。对于传输系数，由Devoto开发的简化的Chapman-Enskog方法使用了最新的碰撞积分，该方法将电子和重物质解耦。计算了不同电子温度（300-40 000 K），电子与重种温度的比率（1-10），压力（0.1-10 atm）和铜摩尔比（0-50％）的热力学和传输性质。发现偏离热平衡强烈地影响SF6-Cu等离子体的热力学和传输性质。此外，铜的存在对热平衡内外的等离子体的某些性质有不同的影响。这些变化的主要原因是非热平衡等离子体的解离反应延迟，进而影响发生的电离反应。

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