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首页> 外文期刊>Materials transactions >The Bondability and Reliability of a Ternary Ag Alloy Wire on an Al Bonding Pad under N_2-Free Conditions
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The Bondability and Reliability of a Ternary Ag Alloy Wire on an Al Bonding Pad under N_2-Free Conditions

机译：在无N_2无条件下氮合金焊盘上的氮合金线的粘合性和可靠性

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摘要

Generally, high-purity 99.99% Au wires are mainly used for electrical connection to transmit and receive data between an Al bonding pad and a printed circuit board (PCB) substrate in semiconductor devices. However, there have been several studies to reduce the cost of expensive Au wires due to the sharp increase in the price of Au. Thus, Ag and Cu alloy wires have been mainly considered as alternative materials.This paper focused on a ternary Ag alloy wire (Au: 1.5%, Pd: 2.5%) and explained free air ball (FAB) shape effects with various electronic flame-off (EFO) conditions in more detail and experimentally showed the susceptibility to bonding failure of the Ag alloy wire after exposure to the atmosphere at room temperature. In particular, a feasible Ag wire bonding process and grain structure effects under N2-free conditions were studied in depth for the first time. With this N2-free condition, weak surface tension of a melting wire led to move FAB quickly to the interface between FAB and heat affected zone (HAZ). In addition, a slender grain structure in the center of FAB area still remained because of the short time current stressing. It made good conductivity and no significant resistance change of a Ag alloy wire. For a Ag alloy wire exposed to the atmosphere for 19 days, the defective percentage during bonding process suddenly started to rise, and reached more than 0.7% in 24 days. According to our results, less than 18 days are highly recommended as a control standard of a Ag alloy wire when it is exposed to the atmosphere. The bonding between a Ag alloy wire and an Al bonding pad was formed without any crack in the lower part of an Al bonding pad. Higher intermetallic compound coverage and minimum Al splash were chosen as key bonding parameters, and KOH cratering tests were performed to secure good bonding quality. Finally, robust Ag wire reliability has been successfully achieved and demonstrated.
机译：通常，高纯度99.99％的AU线主要用于电连接以在半导体器件中发送和接收Al键合焊盘和印刷电路板（PCB）衬底之间的数据。然而，由于Au价格急剧增加，已经有几项研究可以降低昂贵的AU电线的成本。因此，Ag和Cu合金电线主要被认为是替代材料。本文集中于三元Ag合金线（AU：1.5％，Pd：2.5％）上，并用各种电子火焰解释了空气球（Fab）形状效果 - 关闭（EFO）条件更详细地，并通过实验表明在室温下暴露于大气中的Ag合金丝粘合失效的易感性。特别地，首次深入研究了不可行的Ag线键合工艺和晶粒结构效应。利用这种无N2的条件，熔化线的弱表面张力LED将Fab迅速移动到Fab和热影响区域（HAZ）之间的界面。此外，由于电流短的时间压力，晶体区域中心的细长晶粒结构仍然保持依赖性。它具有良好的电导率和Ag合金线的显着电阻变化。对于暴露于大气的Ag合金丝19天，粘接过程中的缺陷率突然开始上升，24天内达到0.7％以上。根据我们的结果，当它暴露于大气时，强烈建议强烈地推荐少于18天的Ag合金线的控制标准。在Al键合垫的下部形成Ag合金线和Al键合垫之间的粘合而没有任何裂缝。选择较高的金属间化合物覆盖率和最小Al Splash作为关键键参数，进行koh起升试验以确保良好的粘接品质。最后，已成功实现和展示了强大的AG线可靠性。

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  • 来源
    《Materials transactions》 |2018年第9期|共6页
  • 作者

    Gun Rae Kim; Sang-Su Ha; Cheol-Hyeon Park;

  • 作者单位

    Technology Quality and Reliability Quality and Reliability Team Foundry Business Samsung Electronics Co. Ltd. San #24 Nongseo-Dong Giheung-Gu Yongin Gyeonggi-Do 17113 Korea;

    Technology Quality and Reliability Quality and Reliability Team Foundry Business Samsung Electronics Co. Ltd. San #24 Nongseo-Dong Giheung-Gu Yongin Gyeonggi-Do 17113 Korea;

    Technology Quality and Reliability Quality and Reliability Team Foundry Business Samsung Electronics Co. Ltd. San #24 Nongseo-Dong Giheung-Gu Yongin Gyeonggi-Do 17113 Korea;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 冶金工业;
  • 关键词

    Ag wire; ternary; N_2 free; corrosion; oxidation; bondability; splash; reliability;

    机译：AG线;三元;N_2自由;腐蚀;氧化;债券;飞溅;可靠性;

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