首页> 外国专利> It possesses high junction reliability and the perfect circle Characteristic where the bonding ball is high, furthermore the Al pad and the gold alloy wire for the bonding wire which the lower part is difficult to be damaged

It possesses high junction reliability and the perfect circle Characteristic where the bonding ball is high, furthermore the Al pad and the gold alloy wire for the bonding wire which the lower part is difficult to be damaged

机译：接合球高，接合可靠性高，圆弧性好，下部的铝焊盘和金合金线难以损坏。

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摘要

PPROBLEM TO BE SOLVED: To provide a gold alloy wire for a bonding wire having high junction reliability and the high roundness of a compressing ball and having an Al pad hardly damaged at its lower part. PSOLUTION: The gold alloy wire contains 2,000-20,000 ppm of one or two of Pt and Pd as a total amount, 1-200 ppm of Ir, 1-40 ppm of Sr, and also contains, as necessary, 1-20 ppm of Ca, a total of 1-20 ppm of at least one of Eu, La and Y in such a manner that a total amount of Sr, Ca, Eu, La and Y is not larger than 40 ppm. The wire also contains, as necessary, a component composition composed of 1-500 ppm of Ag and Au and inevitable impurity as a remaining composition. PCOPYRIGHT: (C)2008,JPO&INPIT

机译：

要解决的问题：提供一种用于接合线的金合金线，该接合线具有高的接合可靠性和压缩球的高的圆度并且在其下部几乎不损坏Al垫。

解决方案：金合金线总共包含2,000-20,000 ppm的Pt和Pd中的一种或两种，1-200 ppm的Ir，1-40 ppm的Sr，并且根据需要还包含1- 20ppm的Ca，以Sr，Ca，Eu，La和Y的总量不大于40ppm的方式，总计1-20ppm的Eu，La和Y中的至少一种。电线还根据需要包含由1-500ppm的Ag和Au以及不可避免的杂质组成的成分组成作为剩余成分。

版权：（C）2008，日本特许厅＆INPIT 展开▼

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公开/公告号JP5071925B2

专利类型
公开/公告日2012-11-14

原文格式PDF
申请/专利权人田中電子工業株式会社;
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申请/专利号JP20060346047
发明设计人牧一誠;中田有治;長尾昌芳;
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申请日2006-12-22
分类号H01L21/60;
国家 JP
入库时间 2022-08-21 16:56:17

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