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首页> 外文期刊>Nanotechnology >The liquid-exfoliation of graphene assisted with hyperbranched polyethylene-g- polyhedral oligomeric silsesquioxane copolymer and its thermal property in polydimethylsiloxane nanocomposite
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The liquid-exfoliation of graphene assisted with hyperbranched polyethylene-g- polyhedral oligomeric silsesquioxane copolymer and its thermal property in polydimethylsiloxane nanocomposite

机译：石墨烯的液体剥离辅助高分子聚乙烯 - G-多面体低聚二氧化硅烷共聚物及其在聚二甲基硅氧烷纳米复合材料中的热性质

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摘要

Thermal interface materials with high thermal conductivity are essential to transfer the redundant heat and improve the reliability of integrated circuits. Here we reported high thermal conductivity in polydimethylsiloxane (PDMS) nanocomposite incorporated with few-layer graphene, which was exfoliated in chloroform with assistance of hyperbranched polyethylene-gpolyhedral oligomeric silsesquioxane copolymer (HBPE@POSS) as the stabilizer. In order to improve the compatibility and enhance the thermal property, the HBPE@POSS copolymer was synthesized via the unique chain walking polymerization mechanism, which subsequently was applied to exfoliate natural graphite into few-layer graphene in low-boiling-point solvents. The majority of resultant nanosheets with low defects was verified with lateral dimension of similar to 400 nm and the thickness of similar to 1.6 nm, which is attributed to the presence of CH-pi noncovalent interaction between graphene and HBPE@POSS copolymer. The graphene nanoplates (GNPs)/polydimethylsiloxane (PDMS) nanocomposites were prepared by solution casting, in which graphene nanofillers were dispersed uniformly in the matrix due to good compatibility between PDMS and oligomeric silsesquioxane segments adsorbed on the nanosheets. The thermal conductivity of 4.0 wt% GNPs/PDMS nanocomposite reaches 0.93 W m(-1) K-1, which is 400% higher than that of pure PDMS. The PDMS nanocomposite incorporated with few-layer graphene exhibits a promising prospect in thermal interface for thermal management of electronic devices, and sheds a light on the interfacial improvement mechanism of thermal conductivity for polymer composite.
机译：具有高导热系数的热界面材料对于转移冗余热量是必不可少的，提高集成电路的可靠性。在这里，我们报道了聚二甲基硅氧烷（PDMS）纳米复合材料中的高导热率，其掺入几层石墨烯，其在氯仿中以超支化聚乙烯-GPolyheLEN寡核苷酸寡烷基胺（HBPE @ POSS）作为稳定剂的辅助。为了改善兼容性和增强热特性，通过独特的链行走聚合机构合成HBPE @ POTS共聚物，随后在低沸点溶剂中施加到几层石墨烯中以将天然石墨施加到几层石墨烯中。横向尺寸验证了具有低缺陷的大部分纳米片，其横向尺寸与400nm相似，厚度与1.6nm相似，归因于石墨烯与HBPE @ POTS共聚物之间的CH-PI非共价相互作用。通过溶液浇铸制备石墨烯纳米层（GNPS）/聚二甲基硅氧烷（PDMS）纳米复合材料，其中由于在纳米晶片上吸附在纳米晶片上的PDMS和低聚硅晶烷段之间的良好相容性，石墨烯纳米填充物在基质中均匀分散。 4.0wt％GNPS / PDMS纳米复合材料的导热率达到0.93WM（-1）k-1，其比纯PDMS高400％。掺入几层石墨烯的PDMS纳米复合材料在热管理电子设备的热界面上表现出具有的有希望的前景，并且揭示了聚合物复合材料的导热率的界面改善机制的光。

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