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首页> 外文期刊>Nanotechnology >Patterning Ag nanoparticles by selective wetting for fine size Cu-Ag-Cu bonding
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Patterning Ag nanoparticles by selective wetting for fine size Cu-Ag-Cu bonding

机译：通过选择性润湿进行纯尺寸Cu-Ag-Cu键合的图案化Ag纳米粒子

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摘要

Metal nanoparticles (NPs) are promising bonding materials to replace Sn alloys in fine size Cu-Cu bonding. However, the method of rapidly patterning NPs on solder joints with sizes less than 30 mu m is one of the main barriers that impede the practical applications of NPs in Cu-Cu bonding, especially in mass production. In this paper, a novel method of patterning Ag NPs on Cu pads by selective wetting was introduced. Cu pads with diameters down to 5 mu m were coated with Ag NPs successfully. When sizes of Cu pads were larger than 10 mu m, high density could be achieved and the ratio of diameters to pitches of Cu pads could reach 2/3. Furthermore, the thickness and the coverage of the Ag NPs layer could be raised by repeating coating. In the bonding test, the shear strength increased significantly with the increase of the bonding temperature and the bonding time. It could reach 22.92 MPa after sintering for 5 min at 250 degrees C under a bonding pressure of 20 MPa in N-2. With the aforementioned advantages, patterning NPs by selective wetting will be one of the potential methods for applying NPs to Cu pads in Cu-NPs-Cu bonding.
机译：金属纳米颗粒（NPS）是有前途的粘合材料，以替代SN合金在细尺寸Cu-Cu键合中。然而，在尺寸小于30μm的焊点上快速图案化NP的方法是妨碍NPS在Cu-Cu键合中的实际应用的主要屏障之一，尤其是批量生产。本文介绍了一种通过选择性润湿的Cu垫在Cu垫上图案化的新方法。直径下达50μm的Cu焊盘成功涂有Ag NPS。当尺寸的Cu焊盘大于10μm时，可以实现高密度并且直径与Cu垫的沥青的比率可以达到2/3。此外，可以通过重复涂层升高Ag NPS层的厚度和覆盖。在粘合试验中，随着粘接温度和键合时间的增加，剪切强度显着增加。在N-2中在20MPa的粘合压力下在250摄氏度下烧结5分钟后，它可以达到22.92MPa。通过上述优点，通过选择性润湿图案化NPS将是用于将NPS在Cu-NPS-Cu键合中施加NPS至Cu焊盘的潜在方法之一。

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  • 来源
    《Nanotechnology》 |2020年第35期|共8页
  • 作者

    Liang Qi; Li Junjie; Li Tianxiang; Liao Guanglan; Tang Zirong; Shi Tielin;

  • 作者单位

    Huazhong Univ Sci &

    Technol State Key Lab Digital Mfg Equipment &

    Technol Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol State Key Lab Digital Mfg Equipment &

    Technol Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol State Key Lab Digital Mfg Equipment &

    Technol Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol State Key Lab Digital Mfg Equipment &

    Technol Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol State Key Lab Digital Mfg Equipment &

    Technol Wuhan 430074 Hubei Peoples R China;

    Huazhong Univ Sci &

    Technol State Key Lab Digital Mfg Equipment &

    Technol Wuhan 430074 Hubei Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 特种结构材料;
  • 关键词

    fine size; Cu-Cu bonding; patterning nanoparticles; selective wetting; bonding test;

    机译：细小;Cu-Cu键合;图案化纳米颗粒;选择性润湿;粘合试验;

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