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Versatile technique for assessing thickness of 2D layered materials by XPS

机译：通过XPS评估2D层材料厚度的多功能技术

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X-ray photoelectron spectroscopy (XPS) has been utilized as a versatile method for thickness characterization of various two-dimensional (2D) films. Accurate thickness can be measured simultaneously while acquiring XPS data for chemical characterization of 2D films having thickness up to approximately 10 nm. For validating the developed technique, thicknesses of few-layer graphene (FLG), MoS2 and amorphous boron nitride (a-BN) layer, produced by microwave plasma chemical vapor deposition (MPCVD), plasma enhanced chemical vapor deposition (PECVD), and pulsed laser deposition (PLD) respectively, were accurately measured. The intensity ratio between photoemission peaks recorded for the films (C 1s, Mo 3d, B 1s) and the substrates (Cu 2p, Al 2p, Si 2p) is the primary input parameter for thickness calculation, in addition to the atomic densities of the substrate and the film, and the corresponding electron attenuation length (EAL). The XPS data was used with a proposed model for thickness calculations, which was verified by cross-sectional transmission electron microscope (TEM) measurement of thickness for all the films. The XPS method determines thickness values averaged over an analysis area which is orders of magnitude larger than the typical area in cross-sectional TEM imaging, hence provides an advanced approach for thickness measurement over large areas of 2D materials. The study confirms that the versatile XPS method allows rapid and reliable assessment of the 2D material thickness and this method can facilitate in tailoring growth conditions for producing very thin 2D materials effectively over a large area. Furthermore, the XPS measurement for a typical 2D material is non-destructive and does not require special sample preparation. Therefore, after XPS analysis, exactly the same sample can undergo further processing or utilization.
机译：X射线光电子能谱（XPS）已被用作各种二维（2D）膜的厚度表征的通用方法。可以同时测量精确的厚度，同时获取XPS数据以进行厚度高达约10nm的2D膜的化学表征。用于验证开发技术，几层石墨烯（FLG），MOS2和无定形氮化硼（A-BN）层的厚度，由微波等离子体化学气相沉积（MPCVD），等离子体增强的化学气相沉积（PECVD）和脉冲产生分别精确测量激光沉积（PLD）。对于薄膜（C 1s，Mo 3D，B 1s）和基板（Cu 2p，Al 2p，Si 2p）记录的光曝光峰之间的强度比是用于厚度计算的主要输入参数，除了原子密度之外基板和膜，以及相应的电子衰减长度（EAL）。 XPS数据与所提出的厚度计算模型一起使用，其通过横截面透射电子显微镜（TEM）测量所有薄膜的厚度验证。 XPS方法确定在分析区域上平均的厚度值，该分析区域是大于横截面TEM成像中的典型区域大的数量级，因此提供了在大面积的2D材料上测量的高级方法。该研究证实，多功能XPS方法允许对2D材料厚度的快速可靠的评估，并且该方法可以促进剪裁生长条件，以有效地在大面积上产生非常薄的2D材料。此外，典型2D材料的XPS测量是非破坏性的，并且不需要特殊的样品制备。因此，在XPS分析之后，完全相同的样品可以进一步处理或利用。

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