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High-performance quantum dot light-emitting diodes using chip-scale package structures with high reliability and wide color gamut for backlight displays

机译:高性能量子点发光二极管,使用芯片级包装结构,具有高可靠性和宽色域的背光显示器

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摘要

High reliability and wide color gamut light-emitting diodes (LEDs) that use composite quantum dot films (CQDFs) protected by chip-scale package (CSP) structures are presented. CQDFs containing CdZnSeS/ZnS core-shell QDs and the K2SiF6:Mn4+ phosphors were mixed with silicone gel and used as color converters in the CSP QD-LEDs. The CSP QD-LEDs, used for backlight displays, transmitted through a color filter and exhibited ITU-R Recommendation BT.2020 of approximately 86% (a National Television System Committee value of 115%). Furthermore, we performed a long-term reliability analysis test on the CSP QD-LEDs for 2352 h to verify whether the optical performance of CSP QD-LEDs does not significantly degrade relative to that of a conventional plastic leaded chip carrier QD-LEDs. We implemented a highly reliable package technology that can protect the QDs, solve the moisture/oxygen problems in defective QD-LEDs, and produce a backlight source for display with a wide color gamut.
机译:提供了使用由芯片级封装(CSP)结构保护的复合量子点薄膜(CSPFS)的高可靠性和宽色域发光二极管(LED)。 CQDFS包含CDZNSES / ZNS核心壳QD和K2SIF6:MN4 +磷光体与硅胶凝胶混合并用作CSP QD-LED中的颜色转换器。 用于背光显示器的CSP QD-LED通过滤色器传输并展示ITU-R建议书,BT.2020大约86%(国家电视系统委员会值为115%)。 此外,我们在CSP QD-LED上对CSP QD-LED进行了长期可靠性分析测试,以验证CSP QD-LED的光学性能是否相对于传统的塑料铅芯片载体QD-LED的光学性能不会显着降低。 我们实施了一种高度可靠的封装技术,可以保护QDS,解决有缺陷的QD-LED中的水分/氧气问题,并产生带有宽色域的显示器的背光源。

著录项

  • 来源
    《RSC Advances》 |2018年第63期|共7页
  • 作者单位

    Feng Chia Univ Dept Photon 100 Wenhwa Rd Taichung 40724 Taiwan;

    Feng Chia Univ Dept Photon 100 Wenhwa Rd Taichung 40724 Taiwan;

    Lextar Elect Corp Hsinchu Sci Pk Hsinchu 30075 Taiwan;

    Lextar Elect Corp Hsinchu Sci Pk Hsinchu 30075 Taiwan;

    Lextar Elect Corp Hsinchu Sci Pk Hsinchu 30075 Taiwan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 化学;
  • 关键词

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