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Synthesis of monolithic shape-stabilized phase change materials with high mechanical stability via a porogen-assisted in situ sol-gel process

机译：通过致原位溶胶 - 凝胶工艺通过致孔剂稳定性合成单片形状稳定的相变材料

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摘要

The confinement of phase change materials (PCMs) in construction materials has recently solved leakage, supercooling and low thermal conductivity problems in the industrial use of PCMs as monolithic thermal energy storage materials. To produce shape-stabilized PCMs (ss-PCMs) as crack-free monoliths, less than 15-30% v/v pure or encapsulated PCMs can be used in construction materials. Therefore, the heat storage capacity of these monolithic ss-PCM boards is comparatively low. In this study, we synthesized a novel class of monolithic ss-PCM boards with high compressive strength of 0.7 MPa at 30 degrees C (1.2 MPa at 10 degrees C), high PCM loadings of 86 wt%, and latent heats in the range of 100 J g(-1)via a porogen-assisted in situ sol-gel process. We confined butyl stearate (BS) as PCM in a core-shell-like silica matrix via stabilized silica sol as silica source, sodium dodecyl sulfate as surfactant and poly(vinyl alcohol) as co-polymer. The ss-PCMs obtained are hydrophobic, thermally stable up to 320 degrees C and perform 6000 state transitions from solid to liquid and vice versa, without losing melting or freezing enthalpies. We analyzed the silica structure in the ss-PCMs to understand in detail the reasons for the high mechanical stability. The silica structure in ss-PCMs consists of spherical meso- and macropores up to 10 000 nm filled with PCM, formed mostly by BS droplets in water as templates during gelation. With an increasing BS amount in the synthesis of ss-PCMs, the total nanopore volume filled with PCM in ss-PCMs increases, resulting in higher compressive strengths up to 500% and thermal conductivities up to 60%.
机译：建筑材料中相变材料（PCMS）的限制最近在PCM的工业用途中解决了泄漏，过冷和低导热性问题，作为单片热能储存材料。为了产生形状稳定的PCM（SS-PCM）作为无裂缝的整体，可以在建筑材料中使用小于15-30％的v / v纯或封装的PCM。因此，这些整体SS-PCM板的储热容量相对较低。在这项研究中，我们在30摄氏度（10摄氏度为1.2MPa）的高压强度为0.7MPa的高压缩强度，高PCM载荷为86wt％，以及86wt％的高抗压强度，以及潜热100 J G（-1）通过致原位溶胶 - 凝胶工艺通过致孔辅助。通过稳定的二氧化硅溶胶作为二氧化硅源，作为表面活性剂和聚（乙烯醇）作为共聚物，将硬脂酸丁酯（BS）作为PCM被限制为PCM作为二氧化硅源，十二烷基硫酸钠和聚（乙烯醇）作为共聚物。获得的SS-PCM是疏水性的，热稳定于320℃，并从固体进行6000个状态转变，反之亦然，而不会失去熔化或冷冻焓。我们分析了SS-PCM中的二氧化硅结构，详细了解了高机械稳定性的原因。 SS-PCM中的二氧化硅结构由球形中间和宏观组成，高达10 000nm填充PCM，主要由水在水中的BS液滴在凝胶化过程中形成。随着SS-PCM的合成中的增加量增加，SS-PCMS中填充PCM的总纳米孔体积增加，导致较高的压缩强度高达500％，导热性高达60％。

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  • 来源
    《RSC Advances》 |2020年第6期|共12页
  • 作者

    Marske Felix; de Souza e Silva Juliana Martins; Wehrspohn Ralf B.; Hahn Thomas; Enke Dirk;

  • 作者单位

    Martin Luther Univ Halle Wittenberg Inst Tech Chem D-06108 Halle Saale Germany;

    Martin Luther Univ Halle Wittenberg Inst Phys D-06108 Halle Saale Germany;

    Martin Luther Univ Halle Wittenberg Inst Phys D-06108 Halle Saale Germany;

    Martin Luther Univ Halle Wittenberg Inst Tech Chem D-06108 Halle Saale Germany;

    Univ Leipzig Inst Chem Technol D-04109 Leipzig Germany;

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