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首页> 外文期刊>RSC Advances >Solvent-free electrically conductive Ag/ethylene vinyl acetate (EVA) composites for paper-based printable electronics
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Solvent-free electrically conductive Ag/ethylene vinyl acetate (EVA) composites for paper-based printable electronics

机译：无溶剂导电Ag /乙烯乙烯基乙酸乙烯酯（EVA）复合材料，用于纸张的可印刷电子产品

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摘要

Solvent-free electrically conductive composites have been applied to flexible electronics to obtain high electrical conductivity. However, some of the proposed composites have low electrical conductivities and are unable to meet the requirements of commercial printable electronics. In this study, solvent-free electrically conductive Ag/EVA (ethylene vinyl acetate) composites for paper-based printable electronics were prepared by a thermal melting method. The properties of these electrically conductive Ag/EVA composites, including particle sizes, morphologies and phase purities of the flake silver flake powders, were investigated using a particle size analyzer, scanning electron microscopy (SEM) and X-ray diffraction (XRD), respectively. The results showed that nanometer-thick flake silver flake powders with smooth and flat surfaces were made by the nanofilm transition technique. These obtained powders were able to form smooth face-to-face contacts, which facilitated the formation of an excellent conductive network in the conductive system. Dynamic mechanical analysis (DMA) was conducted to investigate the mechanical properties of EVA and Ag/EVA composites. A Fourier transformation infra-red (FTIR) spectrometer, laser micro-Raman spectrometer and thermogravimetric analyzer were used to analyze the organic functional groups, glass transition temperatures and thermal weight losses of the EVA resin and solvent-free electrically conductive composites. The solvent-free electrically conductive Ag/EVA composite, which contained 55 wt% of the as-prepared flake silver flake powders, was found to have an extremely low volume resistivity of 1.23 x 10(-4) omega cm as well as excellent bending performance and adhesion. These features indicate the great potential of these composites for application in printed electronics.
机译：无溶剂导电复合材料已应用于柔性电子器件以获得高电导率。然而，一些提出的复合材料具有低电导率，并且无法满足商业可印刷电子设备的要求。在该研究中，通过热熔法制备纸基可印刷电子器件的无溶剂导电Ag / EVA（乙烯乙烯酯）复合材料。使用粒度分析仪，扫描电子显微镜（SEM）和X射线衍射（XRD）来研究这些导电Ag / EVA复合材料的这些电导电Ag / EVA复合材料，包括薄片银薄片粉末的相纯度。结果表明，纳米膜过渡技术制造了具有光滑和平坦表面的纳米厚的片状银薄粉。这些获得的粉末能够形成光滑的面对面触点，这促进了在导电系统中形成优异的导电网络。进行动态力学分析（DMA）以研究EVA和AG / EVA复合材料的机械性能。傅里叶变换红外线（FTIR）光谱仪，激光微拉曼光谱仪和热重分析仪用于分析EVA树脂和无溶剂导电复合材料的有机官能团，玻璃化转变温度和热量损失。含有55wt％的AS制备的片状银片粉末的无溶剂导电Ag / EVA复合材料具有极低的体积电阻率为1.23×10（-4）ωcm以及优异的弯曲性能和附着力。这些特征表示这些复合材料的巨大潜力，用于在印刷电子器件中应用。

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  • 来源
    《RSC Advances》 |2019年第34期|共7页
  • 作者

    Shen Yuqiu; Chen Zhenxing; Zhou Yong; Lei Zuomin; Liu Yi; Feng Wenchao; Zhang Zhuo; Chen Houfu;

  • 作者单位

    Sun Yat Sen Univ Sch Chem Engn &

    Technol Tangjiawan 519082 Zhuhai Peoples R China;

    Sun Yat Sen Univ Sch Chem Engn &

    Technol Tangjiawan 519082 Zhuhai Peoples R China;

    Sun Yat Sen Univ Sch Chem Engn &

    Technol Tangjiawan 519082 Zhuhai Peoples R China;

    Sun Yat Sen Univ Sch Chem Engn &

    Technol Tangjiawan 519082 Zhuhai Peoples R China;

    Sun Yat Sen Univ Sch Chem Engn &

    Technol Tangjiawan 519082 Zhuhai Peoples R China;

    Sun Yat Sen Univ Sch Chem Engn &

    Technol Tangjiawan 519082 Zhuhai Peoples R China;

    Sun Yat Sen Univ Sch Chem Engn &

    Technol Tangjiawan 519082 Zhuhai Peoples R China;

    Sun Yat Sen Univ Sch Chem Engn &

    Technol Tangjiawan 519082 Zhuhai Peoples R China;

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