• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>RSC Advances >Synthesis of graphene via electrochemical exfoliation in different electrolytes for direct electrodeposition of a Cu/graphene composite coating
【24h】

Synthesis of graphene via electrochemical exfoliation in different electrolytes for direct electrodeposition of a Cu/graphene composite coating

机译：用电化学剥离在不同电解质中的直接电沉积在Cu /石墨烯复合涂层的情况下，用电化学剥离合成

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Directly dispersing graphene into an electrolyte still remains a crucial difficulty in electrodepositing a graphene enhanced composite coating onto electrical contact materials. Herein, graphene was synthesized via electrochemical exfoliation in an N,N-dimethylformamide (DMF)/H2O solution containing (NH4)(2)SO4. The electrochemically exfoliated graphene nanosheets (GNs) were directly dispersed by sonication. In comparison with graphene synthesized from aqueous solution, the GNs electrochemically exfoliated in the DMF/H2O-(NH4)(2)SO4 solution exhibit a lower degree of oxidation. Cu/graphene composite coatings were subsequently electrodeposited onto Cu foils by adding Cu2+ into the as-fabricated graphene solution. The surface nanostructure of the Cu/graphene composite coatings was transformed from loose pine needles to a uniform and compact structure with an increase in the concentration of Cu2+, which indicated that the controllable synthesis of Cu/graphene composite coatings with different performances could be achieved in graphene dispersions after adding Cu2+. In order to synthesize graphene via electrochemical exfoliation and directly electrodeposit a Cu/graphene composite coating without adding CuSO4 or any other additive, an attempt was made to directly electrodeposit a Cu/graphene composite coating in CuSO4/DMF/H2O solution after electrochemical exfoliation.
机译：将石墨烯直接分散到电解质中仍然仍然是在电接触材料上电沉积石墨烯增强的复合涂层的关键困难。在此，通过含有（NH 4）（2）SO 4的N，N-二甲基甲酰胺（DMF）/ H 2 O溶液中的电化学剥离，通过电化学剥离合成石墨烯。电化学剥离的石墨烯纳米片（GNS）通过超声处理直接分散。与由水溶液合成的石墨烯相比，在DMF / H 2 O-（NH 4）（2）SO4溶液中电化学剥离的GNS表现出较低的氧化程度。随后通过将Cu 2 +加入到制造的石墨烯溶液中，将Cu /石墨烯复合涂层电涂在Cu箔上。将Cu /石墨烯复合涂层的表面纳米结构从松散的松针转化到均匀且紧凑的结构，随着Cu2 +的浓度而增加，表明可以实现具有不同性能的Cu /石墨烯复合涂层的可控合成加入Cu 2 +后的石墨烯分散体。为了通过电化学剥离和直接电沉积Cu /石墨烯复合涂层合成石墨烯，无需添加CUSO4或任何其他添加剂，在电化学剥离后直接在CUSO4 / DMF / H2O溶液中直接电沉积Cu /石墨烯复合涂层。

著录项

  • 来源
    《RSC Advances》 |2019年第61期|共8页
  • 作者

  • 作者单位
  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 化学;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号