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首页> 外文期刊>Optik: Zeitschrift fur Licht- und Elektronenoptik: = Journal for Light-and Electronoptic >Strain transferring mechanism analysis of the substrate-bonded FBG sensor
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Strain transferring mechanism analysis of the substrate-bonded FBG sensor

机译:基材键合FBG传感器的应变转移机理分析

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AbstractOne of the important application forms of Fiber Bragg grating (FBG) is to measure strain by pasting on the surface of structure. In order to improve the strength of surface-bonding FBG, packaging substrate in metal slice is designed and applied. On the basis of previous studies, an analytic model of the substrate-bonded FBG sensor is developed to predict the strain transfer rate. Moreover, the effects of substrate material and sizes on the strain transfer rate of substrate-bonded FBG are analyzed and compared. Finally, the theoretical analysis results are verified by experimental results. There is a good correspondence between the calculated values and experimental results.]]>
机译:<![CDATA [ 抽象 一的光纤布喇格的重要应用形式光栅(FBG)是通过粘贴结构的表面上以测量应变。为了改善表面粘合FBG的强度,在包装片的金属基板被设计和应用。以前的研究的基础上,在衬底键合的FBG传感器的分析模型来预测的应变传输速率。此外,基体材料和在基片键合的FBG的应变传输速率的大小的影响进行了分析和比较。最后,理论分析结果通过实验验证。有计算值和实验结果之间有良好的对应 ]]>

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