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首页> 外文期刊>Physics in medicine and biology. >Three-dimensional cascaded system analysis of a 50 μm pixel pitch wafer-scale CMOS active pixel sensor x-ray detector for digital breast tomosynthesis
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Three-dimensional cascaded system analysis of a 50 μm pixel pitch wafer-scale CMOS active pixel sensor x-ray detector for digital breast tomosynthesis

机译：50μm像素间距晶片尺度CMOS的三维级联系统分析，用于数字乳房断层合成的50μm像素间距晶片级CMOS活性像素传感器X射线检测器

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High-resolution, low-noise x-ray detectors based on the complementary metal-oxide-semiconductor (CMOS) active pixel sensor (APS) technology have been developed and proposed for digital breast tomosynthesis (DBT). In this study, we evaluated the three-dimensional (3D) imaging performance of a 50 μm pixel pitch CMOS APS x-ray detector named DynAMITe (Dynamic Range Adjustable for Medical Imaging Technology). The two-dimensional (2D) angle-dependent modulation transfer function (MTF), normalized noise power spectrum (NNPS), and detective quantum efficiency (DQE) were experimentally characterized and modeled using the cascaded system analysis at oblique incident angles up to 30°. The cascaded system model was extended to the 3D spatial frequency space in combination with the filtered back-projection (FBP) reconstruction method to calculate the 3D and in-plane MTF, NNPS and DQE parameters. The results demonstrate that the beam obliquity blurs the 2D MTF and DQE in the high spatial frequency range. However, this effect can be eliminated after FBP image reconstruction. In addition, impacts of the image acquisition geometry and detector parameters were evaluated using the 3D cascaded system analysis for DBT. The result shows that a wider projection angle range (e.g. ±30°) improves the low spatial frequency (below 5 mm~(1)) performance of the CMOS APS detector. In addition, to maintain a high spatial resolution for DBT, a focal spot size of smaller than 0.3 mm should be used. Theoretical analysis suggests that a pixelated scintillator in combination with the 50 μm pixel pitch CMOS APS detector could further improve the 3D image resolution. Finally, the 3D imaging performance of the CMOS APS and an indirect amorphous silicon (a-Si:H) thin-film transistor (TFT) passive pixel sensor (PPS) detector was simulated and compared.
机译：高分辨率的基础上，互补金属氧化物半导体的低噪声的X射线探测器（CMOS）有源像素传感器（APS）的技术已被开发并提出了用于数字乳房断层合成（DBT）。在这项研究中，我们评估了50μm的像素间距CMOS APS命名炸药（动态范围为可调医学影像技术）X射线检测器的三维（3D）成像性能。二维（2D）与角度相关的调制传递函数（MTF），归一化的噪声功率谱（专业NNP）和检测量子效率（DQE）进行了实验，其特征在于，用在斜入射在分析级联系统角达30建模° 。级联系统模型扩展到与所述滤波反投影（FBP）重构方法组合的三维空间频率的空间来计算3D和平面内MTF，和专业NNP DQE参数。该结果表明，该光束倾角模糊了2D MTF和DQE在高空间频率范围。然而，这种效果可以FBP图像重构之后被消除。另外，图像获取的几何形状和检测器参数的影响使用DBT的三维分析级联系统进行了评价。结果表明，更宽的投影角度范围（例如±30°）提高了低空间频率（小于5mm〜（1））的CMOS APS检测器的性能。此外，为了维持DBT高空间分辨率，应采用小于0.3mm的焦斑大小。理论分析表明，与50微米像素间距CMOS APS检测器组合的像素化闪烁器可以进一步改善3D图像的分辨率。最后，CMOS APS以及间接非晶硅的3D成像性能（的a-Si：H）薄膜晶体管（TFT）的被动式像素传感器（PPS）检测器进行了模拟和比较。

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