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首页> 外文期刊>The International Journal of Advanced Manufacturing Technology >A study on film hole drilling of IN718 superalloy via laser machining combined with high temperature chemical etching
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A study on film hole drilling of IN718 superalloy via laser machining combined with high temperature chemical etching

机译：通过激光加工结合高温化学蚀刻的IN718超合金薄膜孔钻孔研究

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摘要

A novel method of laser machining combined with high temperature chemical etching (LMHTCE) was proposed. This novel method can take full advantage of both approaches to drill film holes in an IN718 superalloy without a recast layer or a heat affect zone (HAZ). A solution of hydrochloric acid and sodium nitrate, which minimally reacts with IN718 at room temperature but rapidly reacts under high temperatures, was tested and chosen. Holes drilled in air, water, and chemical solutions by a pulsed laser of 1064 nm were studied, and scanning electron microscope (SEM) and energy dispersive spectrometer (EDS) were employed to detect the morphology of the holes and the elemental distribution in different zones. The holes processed in the chemical solution had fewer defects compared with those in the other two mediums. The defocusing distance parameter was optimized to minimize the hole diameter and taper. When the defocusing distance was 0 mu m in the drilling stage and - 60 mu m in the high temperature chemical etching stage, a hole with a smaller diameter and taper can be obtained.
机译：提出了一种与高温化学蚀刻（LMHTCE）结合的新型激光加工方法。这种新方法可以充分利用两种钻膜孔中的钻孔孔，在没有重档层或热影响区（HAZ）的情况下。盐酸和硝酸钠的溶液在室温下与IN718的影响最小，但在高温下快速反应，并进行测试并选择。通过1064nm的脉冲激光器在空气，水和化学溶液中钻出的孔，并采用扫描电子显微镜（SEM）和能量分散光谱仪（EDS）来检测孔的形态和不同区域的元素分布。与其他两种培养基中的那些相比，在化学溶液中加工的孔具有更少的缺陷。优化散焦距离参数以最小化孔直径和锥度。当钻孔距离在钻孔距离为0μm时，高温化学蚀刻阶段中的60μm，可以获得具有较小直径和锥度的孔。

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