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首页> 外文期刊>The journal of physical chemistry, C. Nanomaterials and interfaces >Ultrasonic-Assisted Sintering of Silver Nanoparticles for Flexible Electronics
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Ultrasonic-Assisted Sintering of Silver Nanoparticles for Flexible Electronics

机译：用于柔性电子的银纳米粒子的超声波辅助烧结

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摘要

A silver nanoparticle sintering method is promising for the fabrication of flexible electronics. An ultrasonic-assisted sintering process is presented to obtain conductive patterns with low resistivity on a paper-based substrate. Compared to the conventional hot-pressing sintering process, the proposed method can efficiently fabricate densified microstructures with better electrical properties at low temperature and pressure. In particular, the effects of ultrasonic effective time, entry time, and amplitude were systematically analyzed. It was found that lower resistivity preferred larger ultrasonic amplitude. The ultrasonic effective time happened during the first 3 min of the entire sintering process, which implied that the ultrasonic synergetic effect occurred at the very beginning stage of the sintering process. Additionally, better conductivity of the sintered patterns was obtained when the ultrasonic entry time was shorter. The mechanism of the synergetic effect of ultrasonic sintering was also discussed in terms of vibration and cyclic stress perspectives. The proposed ultrasonic-assisted sintering method is believed to provide insights for the fabrication of flexible electronics.
机译：银纳米粒子烧结方法是对柔性电子的制造的承诺。提出了超声波辅助烧结过程，以获得具有低电阻率的纸基底具有低电阻率的导电图案。与传统的热压烧结过程相比，所提出的方法可以有效地制造致密的微观结构，在低温和压力下具有更好的电性能。特别地，系统地分析了超声波有效时间，进入时间和幅度的影响。发现电阻率较低的电阻率优于更大的超声幅度。在整个烧结过程的前3分钟内发生超声波有效时间，这暗示了在烧结过程的非常开始阶段发生超声协同效应。另外，当超声进入时间较短时，获得烧结图案的更好的电导率。在振动和循环应力视角方面还讨论了超声波烧结协同效应的机制。所提出的超声波辅助烧结方法被认为为柔性电子制造提供了洞察力。

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