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首页> 外文期刊>Journal of Applied Polymer Science >Heat-triggered poly(siloxane-urethane)s based on disulfide bonds for self-healing application
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Heat-triggered poly(siloxane-urethane)s based on disulfide bonds for self-healing application

机译：基于用于自愈合应用的二硫键的热触发聚（硅氧烷 - 氨基甲酸酯）S.

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Polydimethylsiloxane (PDMS) is one of the most widely employed silicon-based polymers for its high flexibility, low usage temperature, excellent water resistance, outstanding electrical insulting property, and physiological inert, etc. However, the covalent-bonded SiO bonds are unable to heal automatically when damaged, which would result in the failure of the materials and devices. Disulfide bond based polymers show high healing efficiency at moderate temperature and have been investigated intensively. Herein, we report a PDMS-based polyurethane self-healing polymer (PDMS-PU) modified with disulfide bonds, which exhibited a reinforced thermal stability, excellent stretchability, and satisfactory self-healing ability. The effect of different ratio of PDMS and disulfide bond contents on the elastomer properties was investigated. With the increase of PDMS content, the decomposition temperature of the PDMS-PU-3 (332 degrees C) elastomer with highest content of PDMS was increased by 34 degrees C compared to PDMS-PU-1 (298 degrees C) with lowest content of PDMS and exhibited a largest elongation at break of 1204%. PDMS-PU-1 with highest content of disulfide bond possessed a highest healing efficiency of 97%. The results indicated the PDMS-PU elastomers can be used as self-healing flexible substrate for flexible electronics. (C) 2018 Wiley Periodicals, Inc.
机译：聚二甲基硅氧烷（PDMS）是最广泛采用的硅基聚合物之一，用于其高柔韧性，低使用温度，优异的耐水性，出色的电腐蚀性和生理惰性等。然而，共价键合的SIO键不能损坏时自动愈合，这将导致材料和设备的失败。二硫键基聚合物在中等温度下表现出高愈合效率，并进行了集中研究。在此，我们报告了用二硫键改性的基于PDMS的聚氨酯自愈合聚合物（PDMS-PU），其表现出增强的热稳定性，优异的拉伸性和令人满意的自我愈合能力。研究了PDMS和二硫键含量不同比率对弹性体性质的影响。随着PDMS含量的增加，与PDMS-PU-1（298℃）相比，PDMS-PU-3（332℃）弹性体具有最高含量的PDMS含量的弹性体的分解温度（298℃）含量最低PDMS并在1204％的突破处表现出最大的伸长率。具有最高含量二硫键含量的PDMS-PU-1具有97％的最高愈合效率。结果表明PDMS-PU弹性体可用作柔性电子器件的自愈合柔性基板。 （c）2018 Wiley期刊，Inc。

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