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首页> 外文期刊>Journal of Applied Polymer Science >Solution processed low-k dielectric core-shell nanoparticles for additive manufacturing of microwave devices
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Solution processed low-k dielectric core-shell nanoparticles for additive manufacturing of microwave devices

机译：溶液加工低K介电芯 - 壳纳米粒子，用于微波器件的添加剂制造

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摘要

This study introduces a new core-shell structured polytetrafluoroethylene (PTFE)/polyimide (PI) nanoparticle for additive manufacturing of microwave substrates. Materials were synthesized using a solution processed method through the electrostatic interaction between PTFE with negative potential and poly(amic acid) salt (PAAS, a PI precursor) with positive potential followed by the thermal imidization of PAAS. Microscopic studies by transmission electron microscopy, scanning electron microscopy, and atomic force microscopy confirmed the formation of core-shell nanoparticles, a porous material network, and a reduction of surface roughness upon imidization. In addition to excellent high temperature stability (<0.4% weight loss at 500 degrees C), the synthesized materials showed improved particle-to-particle adhesion and particle-to-substrate adhesion compared to PTFE alone, and good dielectric properties measured at 7.2 GHz utilizing a cavity perturbation technique. The materials consisting of 5% to 35% of PI exhibited low relative permittivity (epsilon') of 2.14 to 2.38 and loss tangent (tan delta) of 0.001 to 0.0018, which make them well suited for use in additive manufacturing. (C) 2017 Wiley Periodicals, Inc.
机译：本研究介绍了一种新的核壳结构聚四氟乙烯（PTFE）/聚酰亚胺（PI）纳米粒子，用于微波基材的添加剂制造。使用溶液加工方法合成材料，通过PTFE与负电位和聚（酰胺酸）盐（PaaS，PI前体）的静电相互作用，其具有正电位，然后是Paa的热酰亚胺化。通过透射电子显微镜，扫描电子显微镜和原子力显微镜进行显微镜研究证实了核心 - 壳纳米颗粒，多孔材料网络的形成，并在酰亚胺化上降低了表面粗糙度。除了优异的高温稳定性（在500℃下<0.4％重量损失）外，合成的材料表明，与单独的PTFE相比，颗粒 - 颗粒粘附和颗粒 - 底物粘附，并在7.2GHz下测量的良好电介质性能利用腔扰动技术。由5％至35％的PI组成的材料表现出2.14至2.38的低相对介电常数（ε'），并且0.001至0.0018的损耗正切（Tan Delta），这使得它们非常适合于添加剂制造。 （c）2017 Wiley期刊，Inc。

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