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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Fabrication and interfacial reaction of carbon nanotube-embedded Sn-3.5Ag solder balls for ball grid arrays
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Fabrication and interfacial reaction of carbon nanotube-embedded Sn-3.5Ag solder balls for ball grid arrays

机译：碳纳米管嵌入式SN-3.5AG焊球用于球栅阵列的制造和界面反应

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摘要

Carbon nanotubes (CNTs) that incorporated Sn-3.5Ag solder balls were fabricated by a surface impact mixing (SIM) process. The SIM process consisted of a ball milling process that provided enough impact energy for CNT embedding on the solder surface and at the same time, maintained the size and shape of the solder balls. As the SIM time increased, the density of the embedded CNTs on the solder surface increased and the entire solder surface was covered with CNTs after 24 h of the SIM process. The shear strength of the CNT-embedded Sn-3.5Ag solder balls increased by 10% after the 24 h-SIM process. The thickness of the intermetallic compound (IMC) layer between the solder and Ni decreased when CNTs were included in the Sn-3.5Ag solder. As aging time increased, the IMC thickness difference between CNT-embedded and non-CNT samples remarkably increased as well.
机译：通过表面冲击混合（SIM）工艺制造掺入SN-3.5AG焊球的碳纳米管（CNT）。 SIM处理包括球磨过程，该过程为CNT嵌入焊料表面上的CNT嵌入而提供了足够的冲击能量，保持焊球的尺寸和形状。 随着SIM时的增加，焊接表面上的嵌入式CNT的密度增加，并且在SIM过程的24小时后用CNT覆盖整个焊料表面。 24 H-SIM处理后，CNT嵌入式SN-3.5AG焊球的剪切强度增加了10％。 当CNT包含在SN-3.5AG焊料中时，焊料和Ni之间的金属间化合物（IMC）层的厚度降低。 随着老化时间增加，CNT嵌入式和非CNT样品之间的IMC厚度差异也显着增加。

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