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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications
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Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications

机译：纳米玻璃浆料的无气压烧结为模板上的模板，用于半导体应用的enig完成

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摘要

In order to overcome interfacial delamination of pressureless sintered nanosilver as die attachment on the ENIG finish, we tried to clarify the densification and interfacial diffusion behavior of sintering nanosilver paste on Au finish. Two different electroless nickel immersion gold (ENIG-1, ENIG-2) and one electroplated nickel gold (electrolytic Au) were compared in the aspects of mechanical, thermal performance, and microstructures. Delamination was found at the as-sintered Ag in the vicinity of Ag/Au interface in the ENIG-1. It was likely that too much Ag atoms was diffused into the ENIG-1, the left Ag atoms of the Ag-NPs in the vicinity of the interface are not sufficient to be densified as a robust sintered Ag joint at the higher temperatures. Electron backscattered diffraction (EBSD) results confirmed that the grain size, the high angle grain boundary, and the (111) texture lead to the rapid non-densifying diffusion of the Ag atoms with the ENIG. We proposed a modified sintering profile and the rougher ENIG-2 with thinner Au finish to reduce the non-densifying diffusion. The performance, and microstructures of the sintered Ag on the ENIG-2 confirmed that it is reasonable to enhance the sintered Ag on ENIG by reducing the rapid non-densifying diffusion at above 150 degrees C. (C) 2018 Elsevier B.V. All rights reserved.
机译：为了克服无压烧结纳米玻璃的界面分层作为模具附着在ENIG结束上，我们试图阐明烧结纳米玻璃浆料对Au饰面的致密化和界面扩散行为。在机械，热性能和微观结构的各方面比较了两个不同的化学镀镍浸渍金（ENIG-1，ENIG-2）和一个电镀镍金（电解质Au）。在ENIG-1中的AG / AU界面附近的AS-Sintered AG中发现分层。显着的Ag原子被扩散到Enig-1中，界面附近的Ag-NP的左代原子不足以在较高温度下被致密于鲁棒烧结的Ag关节。电子背散射衍射（EBSD）结果证实，晶粒尺寸，高角度晶界和（111）纹理导致Ag原子与eNIG的快速非致密化扩散。我们提出了一种改进的烧结型材和具有较薄的Au终点的粗置钻孔型材，以减少不致密的扩散。 ENIG-2上烧结型AG的性能和微观结构证实，通过减少在150摄氏度的快速非致密扩散，增强烧结AG在ELEVIER B.V中的快速非致密化扩散是合理的。保留所有权利。

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