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首页> 外文期刊>International Journal of Adhesion & Adhesives >Digital image correlation strain measurement of thick adherend shear test specimen joined with an epoxy film adhesive
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Digital image correlation strain measurement of thick adherend shear test specimen joined with an epoxy film adhesive

机译：用环氧膜粘合剂加入厚粘物剪切试样的数字图像相关应变测量

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摘要

Structural bonding and bonded repairs of composite materials become more and more important. Understanding the strain within the bondline leads to suitable bonding design. For new design approaches the strain distribution within the bondline has to be analyzed. Thus, often finite element analysis (FE) are used. However, a huge challenge is the availability of reliable material properties for the adhesives and their validation. Previous work has shown that it is possible to measure the small displacements resulting within thin epoxy film adhesives using high resolution digital image correlation (DIC). In this work a 2D DIC setup with a high resolution consumer camera is used to visualize the strain distribytion within the bondline over the length of the joint as well as over the adhesive thickness. Therefore, single lap joints with thick aluminum adherends according to ASTM D 5656 are manufactured and tested. Local 2D DIC strain measurements are performed and analyzed. Two different camera setups are used and compared. The evaluation provides reliable material data and enables a look insight the bondline. The results of the full field strain data measured with DIC are compared with numerical simulations. Thus, material models as well as chosen parameters for the adhesive are validated. Compared to extensometers, giving only point-wise information for fixed measuring points, the DIC allows a virtual point-wise inspection along the complete bondline. Furthermore, it allows measuring close to the bondline to reduce the influence of adherend deformation.
机译：复合材料的结构粘合和粘合修复变得越来越重要。理解粘合线内的应变导致合适的粘合设计。对于新设计，方法必须分析粘结线内的应变分布。因此，通常使用有限元分析（Fe）。然而，巨大的挑战是粘合剂的可靠材料特性及其验证。以前的工作表明，可以使用高分辨率数字图像相关（DIC）测量在薄的环氧膜粘合剂内产生的小位移。在这项工作中，使用高分辨率消费者摄像机的2D DIC设置用于在关节的长度以及粘合剂厚度上可视化键合线内的应变分布。因此，根据ASTM D 5656具有厚铝粘附的单圈接头是制造和测试。进行局部2D DIC应变测量并分析。使用两种不同的相机设置并进行比较。评估提供可靠的材料数据，并启用粘合线的外观。用DIC测量的全场应变数据的结果与数值模拟进行比较。因此，验证了材料模型以及所选择的粘合剂参数。与伸长仪相比，仅提供用于固定测量点的方向信息，DIC允许沿着完整的键合的虚拟点明智检查。此外，它允许测量靠近键合线，以减少粘物变形的影响。

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