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首页> 外文期刊>International Journal of Adhesion & Adhesives >A thick bondline beam model for the adhesively bonded 3-point bending specimen
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A thick bondline beam model for the adhesively bonded 3-point bending specimen

机译：厚粘结线梁模型，用于粘接3点弯曲试样

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摘要

The adhesively bonded 3-point bending specimen has been recently considered for evaluating the adhesive shear stress-strain behaviour. Its main advantage is avoiding the spurious end effects typical of lap-joints. A previous beam model proved to be fairly accurate for thin bondlines typical of structural joints. The present study extends such model to thick bondlines and achieves improved shear strain results. Model predictions were in very good agreement with finite element analyses of specimens with metal adherends and adhesive elastic-perfectly plastic behaviour. The present model will facilitate the inverse method needed to evaluate the parameters of a piecewise linear approximation to the adhesive shear stress-strain curve. Furthermore, two simplified models were shown to provide useful bounds for the shear stress-strain curve using only the basic load-displacement data.
机译：最近已经考虑了粘合的3点弯曲试样用于评估粘合剂剪切应力 - 应变行为。 其主要优点是避免了典型的搭接关节的杂散终端效果。 先前的光束模型对于典型的结构关节典型的薄键线是相当准确的。 本研究将这种模型延伸到厚键线，并达到改善的剪切应变结果。 模型预测与带有金属的标本的有限元分析非常良好，具有金属粘附和粘合剂弹性 - 完美的塑性行为。 本模型将促进评估分段线性近似的参数所需的逆方法，粘合剪切应变曲线。 此外，示出了两个简化模型，仅使用基本负载 - 位移数据为剪切应力 - 应变曲线提供有用的界限。

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