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首页> 外文期刊>International Journal of Quality Engineering and Technology >Parameter optimisations for gold electroplating of gold jewellery
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Parameter optimisations for gold electroplating of gold jewellery

机译：金珠宝金电镀参数优化

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摘要

The purpose of this research is to reduce the over-specification of thickness in electroplating process of gold jewellery using experimental design for analysing optimisation of parameter conditions affecting thickness of gold jewellery in electroplating process and finding optimisation for controlling specification and reducing average thickness. The factors were electroplating period, gold concentration, the electric current and the electroplating temperature. Each factor had two levels. There were four responses collected, that were average gold thickness ( Y _(1)), minimum value of gold thickness ( Y _(2)), standard deviation of gold thickness ( Y _(3)) and average of gold on stainless steel sheet ( Y _(4)). 0.05 significance level was used. The results showed that the appropriate parameters were 17 minutes of electroplating period, 0.4 gram per litre of gold concentration, 0.6 amperes per square decimetre of electric current and 60 degree Celsius of electroplating temperature. The experiment could reduce the electroplating period by 4.20 minutes, the average gold thickness jig by 0.13 micron, minimum of gold thickness by 0.19 micron, and average gold percentage by 3.91 percent. These results reduced specification from maximum value of thickness from 3.75 micron to 3.55 micron and mid-thickness average from 3.50 micron to 3.45 micron.
机译：本研究的目的是使用实验设计减少金珠宝电镀过程中的厚度的过度规范，用于分析影响电镀过程中的金色珠宝厚度的参数条件的优化，并找到控制规范的优化，降低平均厚度。因素是电镀周期，金浓度，电流和电镀温度。每个因素有两个级别。收集了四种反应，即平均金厚度（Y _（1）），金厚度的最小值（Y _（2）），金厚度的标准偏差（Y _（3））和不锈钢的金平均金钢板（Y _（4））。使用了0.05个显着性水平。结果表明，适当的参数为17分钟的电镀周期，每升每升金浓度为0.4克，每平方电流为0.6安培，电镀温度为60摄氏度。该实验可以将电镀周期减小4.20分钟，平均金厚度夹具0.13微米，最小金厚度为0.19微米，水平百分比为3.91％。这些结果从3.75微米到3.55微米的最大厚度和3.55微米和3.55微米的中间厚度为3.45微米，降低了规格。

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