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首页> 外文期刊>International Journal of Sustainable Manufacturing >A fracture mechanics approach to enhance product and process sustainability in diamond wire sawing of silicon wafers for solar cells through improved wire design
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A fracture mechanics approach to enhance product and process sustainability in diamond wire sawing of silicon wafers for solar cells through improved wire design

机译：通过改进的电线设计改善太阳能电池硅晶片硅晶片钻石锯材的产品和过程可持续性的裂缝力学方法

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摘要

By decreasing the subsurface damage in silicon wafers produced by diamond wire sawing, the mechanical strength of wafers can be increased, and' the amount of silicon to be etched in subsequent manufacturing steps can be minimised, enhancing both product and process sustainability. Apart from the sawing process parameters, the subsurface damage in as-sawn silicon wafers is influenced by the design of the diamond wire. We present a fracture mechanics approach for the design of fixed abrasive diamond wires used in wire sawing of silicon wafers for solar cells. Starting from an allowable damage (crack) depth, indentation fracture mechanics and contact analysis are used to determine the wire design parameters, namely the grit protrusion and peripheral distribution of diamond abrasives. The improved wire design can reduce subsurface damage and thereby improve the surface integrity (product sustainability), and reduce the processing time and chemicals used in the subsequent saw-damage removal step (process sustainability).
机译：通过减小由金刚石锯切制造的硅晶片中的地下损伤，可以增加晶片的机械强度，并且可以最小化在随后的制造步骤中蚀刻的硅的量，增强了产品和工艺可持续性。除了锯切工艺参数外，AS-SAWN硅晶片的地下损坏受金刚石线的设计影响。我们提出了一种骨折力学方法，用于设计用于太阳能电池硅晶片的硅晶片线锯切的固定磨料金刚石线。从允许的损坏（裂缝）深度开始，压痕断裂力学和接触分析用于确定电线设计参数，即金刚石磨料的砂砾突起和外围分布。改进的电线设计可以减少地下损伤，从而提高表面完整性（产品可持续性），并减少随后的锯损除去步骤（过程可持续性）中使用的处理时间和化学品。

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