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首页> 外文期刊>Engineering Fracture Mechanics >Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling
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Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling

机译：实验微剪切试验电力电子包装损伤和断裂模式的识别及有限元模拟

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Micro-shear tests are performed in order to characterize the mechanical behavior and the fracture of the chip/metallized ceramic substrate assemblies of power electronic devices. These assemblies are elaborated using three types of junctions: AuGe solder/Au or Ag finish, transient liquid phase bonding (TLPB) AgIn/Ag finish and Ag nanoparticles/Au or Ag finish. The experiments are associated to finite element simulations of both nano-indentation and micro-shear tests. The mechanical behavior of the different assembly interfaces is represented using an in-built cohesive zone model (CZM) available in the user friendly finite element code Abaqus (R). It is worth noting that the fracture mechanisms observed during the test and service periods of the power electronic packaging are not only due to the debonding at the interfaces but also to the initiation and growth of voids in the joint. Therefore, in addition to the CZM model, Gurson-Tvergaard-Needlmann (GTN) damage model is used in combination with the Rice bifurcation theory to correctly describe the fracture in the joint and, therefore the overall fracture mechanism of the entire junction. The simulation results are compared with the experimental force displacement curves and the SEM observations in order to assess the implemented model. (C) 2017 Elsevier Ltd. All rights reserved.
机译：进行微剪切测试，以表征电力电子设备的芯片/金属化陶瓷基板组件的机械行为和裂缝。使用三种类型的连接进行阐述这些组件：Auge焊料/ Au或Ag饰面，瞬态液相键合（TLPB）Agin / Ag饰面和Ag纳米颗粒/ Au或Ag饰面。实验与纳米压痕和微剪切试验的有限元模拟相关。不同装配界面的机械行为使用用户友好的有限元代码ABAQUS（R）中提供的内置衔接区域模型（CZM）表示。值得注意的是，在电力电子包装的测试和服务期间观察到的裂缝机制不仅是由于接口处的剥离而且对关节中空隙的开始和生长。因此，除了CZM模型之外，Gurson-Tvergaard-ConsureLmann（GTN）损伤模型与稻米分岔理论结合使用，以正确描述关节中的骨折，因此是整个交界处的整体断裂机制。将模拟结果与实验力位移曲线和SEM观测进行比较，以评估实施的模型。 （c）2017 Elsevier Ltd.保留所有权利。

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