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Analysis of Microwave Passive Circuits Designed Using 3D Printing Techniques

机译:采用3D打印技术设计微波无源电路

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This work presents the results of a preliminary study conducted to assess the viability of using 3D printing techniques for the manufacturing of microwave passive circuits based on microstrip techniques, both for prototyping new low-cost devices and for fast and costless testing of new circuits designs. The study was aimed to test two crucial factors in the viability of these procedures: the performance of the circuit in terms of its functionality and the structural integrity of the resulting structure. A low-cost 3D printer is proposed for the dielectric substrate design of microstrip circuits. Standard PolyLactic Acid (PLA) material has been characterized in the microwaves frequencies for different substrate sizes and densities. To verify the proposed method, a low-pass stepped impedance filter was designed, simulated, and measured. Finally, a structural analysis using Non-Destructive Testing (NDT) ultrasonic techniques has been carried out based on deconvolution and resonant spectroscopy. Both, electronic and structural results, have shown the feasibility of using low-cost additive techniques in the design of microwave circuits.
机译:这项工作提出了一种初步研究的结果,以评估使用3D打印技术基于微波无源电路的使用基于微带技术,用于原型设计新的低成本装置,以及用于新电路设计的快速和成本测试。该研究旨在在这些程序的可行性中测试两个关键因素:在其功能和所得结构的结构完整性方面的性能和所得结构的结构完整性。提出了一种低成本的3D打印机,用于微带电路的介电基板设计。标准聚乳酸(PLA)材料的特征在于用于不同衬底尺寸和密度的微波频率。为了验证所提出的方法,设计了低通阶梯式阻抗滤波器,模拟和测量。最后,使用非破坏性测试(NDT)超声技术的结构分析已经基于去卷积和谐振光谱进行。无论是电子和结构的结果,都表明了在微波电路设计中使用低成本添加剂技术的可行性。

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