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机译:通过合金化硼对Cu基质进行剪裁界面结构并提高Cu /金刚石复合材料的导热率
Univ Sci &
Technol Beijing State Key Lab Adv Met &
Mat Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing State Key Lab Adv Met &
Mat Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing State Key Lab Adv Met &
Mat Beijing 100083 Peoples R China;
Univ Sci &
Technol Beijing Collaborat Innovat Ctr Steel Technol Beijing 100083 Peoples R China;
Univ Texas Dallas Dept Mat Sci &
Engn Richardson TX 75080 USA;
Univ Texas Dallas Dept Mat Sci &
Engn Richardson TX 75080 USA;
Univ Sci &
Technol Beijing State Key Lab Adv Met &
Mat Beijing 100083 Peoples R China;
Metal matrix composites (MMCs); High-resolution electron microscopy; Interface structure; Thermal conductivity;
机译:通过合金化硼对Cu基质进行剪裁界面结构并提高Cu /金刚石复合材料的导热率
机译:结合CR预涂层和Cr合金化,提高金刚石颗粒增强Cu基质复合材料的导热率
机译:通过界面层优化在金刚石颗粒分散的Zr合金Cu基复合材料中实现高导热性
机译:CR加法和加工条件对金刚石/ Cu复合材料界面微观结构和导热系数的影响
机译:热和化学刺激驱动的Cu和Cu合金的表面和界面动力学
机译:Zr-Cu合金粉对高比对薄片石墨Cu基质复合材料微观结构及性能的影响
机译:硼添加对SPS制造的Cu /金刚石复合材料热导率的影响