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Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix

机译:通过合金化硼对Cu基质进行剪裁界面结构并提高Cu /金刚石复合材料的导热率

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摘要

Diamond particles reinforced Cu matrix (Cu/diamond) composites were prepared by alloying 0.1-1.0 wt% B to the Cu matrix in order to tailor the interface structure. The interface structure evolves from discrete triangular carbides into continuous jig-saw carbides depending on the availability of boron source in the Cu-B matrix. We report the highest thermal conductivity of 868 W/mK so far in boron-modified Cu/diamond composites, which originates from the discontinuous carbide interface in the Cu-B/diamond composites. The parallel connection of interfacial thermal resistances of the discontinuous carbide interface reduces the total interfacial thermal resistance and therefore promotes phonon transfer across the Cu/diamond interface. We clarify the formation mechanism of discontinuous carbide interface in the Cu-B/diamond composites and demonstrate the decisive role of discrete triangular carbides in enhancing thermal conductivity of Cu/diamond composites. The results help to establish the method of metal matrix alloying to prepare Cu/diamond composites with high thermal conductivity for thermal management applications.
机译:通过将0.1-1.0wt%B合金化为Cu基质来制备金刚石颗粒增强Cu基质(Cu /金刚石)复合材料以定制界面结构。根据Cu-B基质中的硼源的可用性,界面结构从离散三角形碳化物进入连续的夹具锯片。我们以硼改性的Cu /金刚石复合材料迄今为止,以硼改性的Cu /金刚石复合材料报告了最高导热率,其源自Cu-B /金刚石复合材料中的不连续碳化物界面。不连续碳化物界面的界面热阻的平行连接降低了总界面热阻,因此促使声子传动在Cu /金刚石界面上。我们阐明了Cu-B /金刚石复合材料中不连续碳化物界面的形成机制,并证明了离散三角形碳化物在提高Cu /金刚石复合材料的导热率方面的决定性作用。结果有助于建立金属基质合金化的方法,以制备具有高导热性的Cu /金刚石复合材料,用于热管理应用。

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