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首页> 外文期刊>Small >Ultrahigh Conductive Copper/Large Flake Size Graphene Heterostructure Thin-Film with Remarkable Electromagnetic Interference Shielding Effectiveness
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Ultrahigh Conductive Copper/Large Flake Size Graphene Heterostructure Thin-Film with Remarkable Electromagnetic Interference Shielding Effectiveness

机译:超高导电铜/大型鳞片尺寸石墨烯异质结构薄膜,具有显着的电磁干扰屏蔽效果

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摘要

To guarantee the normal operation of next generation portable electronics and wearable devices, together with avoiding electromagnetic wave pollution, it is urgent to find a material possessing flexibility, ultrahigh conductive, and superb electromagnetic interference shielding effectiveness (EMI SE) simultaneously. In this work, inspired by a building bricks toy with the interlock system, we design and fabricate a copper/large flake size graphene (Cu/LG) composite thin film (≈8.8 μm) in the light of high temperature annealing of a large flake size graphene oxide film followed by magnetron sputtering of copper. The obtained Cu/LG thin-film shows ultrahigh thermal conductivity of over 1932.73 (±63.07) W m~(-1) K~(-1) and excellent electrical conductivity of 5.88 (±0.29) × 10~6 S m~(-1). Significantly, it also exhibits a remarkably high EMI SE of over 52 dB at the frequency of 1-18 GHz. The largest EMI SE value of 63.29 dB, accorded at 1 GHz, is enough to obstruct and absorb 99.99995% of incident radiation. To the best of knowledge, this is the highest EMI SE performance reported so far in such thin thickness of graphene-based materials. These outstanding properties make Cu/LG film a promising alternative building block for power electronics, microprocessors, and flexible electronics.
机译:为了保证下一代便携式电子产品和可穿戴设备的正常操作,以及避免电磁波污染,迫切需要寻找具有灵活性,超高导电和超级电磁干扰屏蔽效果(EMI SE)的材料。在这项工作中,灵感来自互锁系统的建筑砖玩具,我们在大型薄片的高温退火的光线下设计和制造铜/大片状石墨烯(Cu / Lg)复合薄膜(≈8.8μm)尺寸的石墨烯氧化物膜,然后是铜的磁控溅射。得到的Cu / Lg薄膜显示出超过1932.73(±63.07)W m〜(-1)k〜(-1)的超高导热率,优异的导电率为5.88(±0.29)×10〜6 s m〜( -1)。值得注意的是,它在1-18GHz的频率下也表现出超过52 dB的显着高的EMI SE。符合1GHz的63.29 dB的最大EMI SE值足以阻塞和吸收99.99995%的入射辐射。据最知识,这是基于石墨烯材料的如此薄的厚度所报道的最高EMI SE性能。这些出色的属性使CU / LG薄膜成为电力电子,微处理器和柔性电子设备的有希望的替代构建模块。

著录项

  • 来源
    《Small》 |2018年第20期|共8页
  • 作者单位

    State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan 430070 China;

    National Graphene Institute University of Manchester Booth Street East Manchester M13 9PL UK;

    Shenzhen Institute of Advanced Graphene Application and Technology (SIAGAT) Shenzhen 518106 China;

    State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan 430070 China;

    National Engineering Laboratory for Fiber Optic Sensing Technology Wuhan University of Technology Wuhan 430070 China;

    Hubei Engineering Research Center of RF-Microwave Technology and Application School of Science Wuhan University of Technology Wuhan 430070 China;

    State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan 430070 China;

    State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan 430070 China;

    Hubei Engineering Research Center of RF-Microwave Technology and Application School of Science Wuhan University of Technology Wuhan 430070 China;

    State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan 430070 China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 特种结构材料;
  • 关键词

    electrical conductivity; electromagnetic interference shielding; films; large flake size graphene; thermal conductivity;

    机译:电导率;电磁干扰屏蔽;薄膜;大型薄片尺寸石墨烯;导热系数;

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