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首页> 外文期刊>Polymers for advanced technologies >Poly(ester imide)s possessing low coefficients of thermal expansion and low water absorption (IV): Effects of ester‐linked tetracarboxylic dianhydrides with longitudinally extended structures
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Poly(ester imide)s possessing low coefficients of thermal expansion and low water absorption (IV): Effects of ester‐linked tetracarboxylic dianhydrides with longitudinally extended structures

机译：具有低热膨胀系数和低吸水性（IV）的聚（酯酰亚胺）S：酯连接的四羧酸二酐与纵向延伸的结构的影响

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> A series of poly(ester imide)s (PEsIs) were prepared using longitudinally extended structures of ester‐linked tetracarboxylic dianhydrides with different numbers of aromatic rings ( N Ar = 4‐6). In the PEsIs obtained using p ‐phenylenediamine ( p ‐PDA), a clear trend was observed: the water absorption ( W A ) decreased with increasing N Ar . In contrast, no clear decrease in the T g with increasing N Ar was observed for the PEsIs obtained using 4,4′‐oxydianiline (4,4′‐ODA). The PEsIs obtained using a methyl‐substituted tetracarboxylic dianhydride ( N Ar = 5) showed more suppressed W A and higher elongation at break ( ε b ) values than those of the nonsubstituted counterparts. The former result is probably closely related to the enhanced crystallinity. However, methyl substitution caused an appreciable reduction in the thermal stability. Thus, the methyl‐substituted PEsIs did not meet the V‐0 standard in the UL‐94V test, unlike the substituent‐free counterparts. The PEsI copolymer obtained using the substituent‐free tetracarboxylic dianhydride ( N Ar = 6) with p ‐PDA (75 mol%) and 4,4′‐ODA (25 mol%) had excellent combined properties, ie, a very high T g (361°C), an ultralow coefficient of thermal expansion (2.2 ppm K ?1 ), an extremely low coefficient of hygroscopic expansion (3.3 ppm/RH%), moderate film ductility ( ε b max = 23%), a moderate dielectric constant (3.22), and a low tan δ (2.76 × 10 ?3 ) at 10 GHz in 50% relative humidity. Thus, this PEsI is a promising novel dielectric substrate material for use in the next generation of high‐performance flexible printed circuit boards.
机译： > 使用具有不同数量的芳环（ n ar = 4-6）。在使用的PESES中 p - 苯二胺（ p -PDA），观察到明确的趋势：吸水率（ w a ）随着增加而减少 n ar 。相比之下，没有明确的减少 t g 随着时间的增加 n ar 观察到使用4,4'- oxydianiline（4,4'-ODA）获得的PERIS。使用甲基取代的四羧酸二酐（ n ar = 5）显示更多抑制 w a 突破的伸长率较高（ ε b ）值比非不合物对应物的值。前一种结果可能与增强的结晶度密切相关。然而，甲基取代导致热稳定性的明显降低。因此，与无取代剂对应物不同，甲基取代的PESES在UL-94V试验中不符合V-0标准。使用无取代的四羧酸二酐（ n ar = 6） p -PDA（75mol％）和4,4'-ODA（25mol％）具有优异的合并性质，即非常高 t g （361°C），超级热膨胀系数（2.2 ppm k ？1 ），极低的吸湿膨胀系数（3.3ppm / rH％），中等胶片延性（ ε b max = 23％），适度介电常数（3.22）和低棕褐色 δ （2.76×10 ？3 ）在50％相对湿度下的10 GHz。因此，该PESI是用于下一代高性能柔性印刷电路板的有前途的新型介电基板材料。

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